Koupit Y92A-72C s BYCHPS
Koupit se zárukou
Y92A-72C
- Part Number:
- Y92A-72C
- Výrobce:
- Omron Automation & Safety
- Popis:
- COVER HARD PLASTIC FOR H5S
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13948 Pieces
- Datový list:
- Y92A-72C.pdf
Úvod
BYCHIPS je distribuční odrůda pro Y92A-72C, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu Y92A-72C e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Specifikace: | - |
|---|---|
| Série: | H5S |
| Ostatní jména: | Y92A-72C-ND Y92A72C Z6278 |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 1 Weeks |
| Výrobní číslo výrobce: | Y92A-72C |
| Pro použití s / příbuzné výrobky: | H5S Series |
| Rozšířený popis: | Cover H5S Series |
| Popis: | COVER HARD PLASTIC FOR H5S |
| Barva: | - |
| Typ příslušenství: | Cover |
| Email: | [email protected] |
Související díly pro Y92A-72C
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
36520-502 | TE Connectivity Potter & Brumfield Relays | COIL KIT 50-60A 208 | Dotaz |
 |
Y92A-48 | Omron Automation and Safety | COVER HARD PROTECTIVE FOR H5CX | Dotaz |
 |
Y92A-72H | Omron Automation and Safety | ACCY HARD PROTECTIVE COVER | Dotaz |
|
36320-530 | TE Connectivity Potter & Brumfield Relays | COIL KIT 20-40A 277V | Dotaz |
|
34220-337N | TE Connectivity Potter & Brumfield Relays | SPDT AUX SWITCH MOD | Dotaz |
|
Y92A-Y1 | Omron Automation and Safety | RING TIME SETTING FOR H2C-S/-SR | Dotaz |
 |
70Z3226-4 | Grayhill Inc. | CASE I/O WHT | Dotaz |
|
Y92A-48G | Omron Automation and Safety | TERM COVER FINGER SAFE H3CR-F | Dotaz |
 |
Y92A-48F1 | Omron Automation and Safety | COVER PROTECTIVE SOFT 48MM IP54P | Dotaz |
|
4-1415034-1 | TE Connectivity Potter & Brumfield Relays | RELAY ACCY | Dotaz |
|
Y92A-48E | Omron Automation and Safety | HARD COVER FOR H5F-FB/KB | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers