Koupit XH311HG-II45E s BYCHPS
Koupit se zárukou
XH311HG-II45E
- Part Number:
- XH311HG-II45E
- Výrobce:
- Seiko Instruments, Inc.
- Popis:
- CAP 20MF 3.3V SURFACE MOUNT
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16885 Pieces
- Datový list:
- XH311HG-II45E.pdf
Úvod
BYCHIPS je distribuční odrůda pro XH311HG-II45E, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu XH311HG-II45E e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 3.3V |
|---|---|
| Tolerance: | - |
| Ukončení: | Surface Mount |
| Velikost / Rozměry: | 0.150" Dia (3.80mm) |
| Série: | XH-HG |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | Coin, Wide Terminals - Opposite Sides |
| Ostatní jména: | 728-1063-2 |
| Provozní teplota: | -20°C ~ 60°C |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | XH311HG-II45E |
| Životnost @ Temp.: | - |
| Rozestup vývodù: | - |
| Výška - Sedící (Max): | 0.043" (1.10mm) |
| Rozšířený popis: | 20mF (EDLC) Supercapacitor 3.3V Coin, Wide Terminals - Opposite Sides |
| ESR (Equivalent Resistance Series): | - |
| Popis: | CAP 20MF 3.3V SURFACE MOUNT |
| kapacitní: | 20mF |
| Email: | [email protected] |
Související díly pro XH311HG-II45E
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
XH311HU-IV07E | Seiko Instruments | CAP 35MF 3.3V SURFACE MOUNT | Dotaz |
 |
EDLSD223H5R5C | Cornell Dubilier Electronics (CDE) | CAP 22MF 5.5V THROUGH HOLE | Dotaz |
 |
FT0H474ZF | KEMET | CAP 470MF -20% +80% 5.5V T/H | Dotaz |
 |
DZ-2R5D275G5T | Elna America | CAP 2.7F -20% +80% 2.5V T/H | Dotaz |
 |
EEC-RG0V155HN | Panasonic Electronic Components | CAP 1.5F 3.6V T/H | Dotaz |
 |
XH311HG-IV07E | Seiko Instruments | CAP 20MF 3.3V SURFACE MOUNT | Dotaz |
 |
HV1325-2R7156-R | Eaton | CAP 15F -10% +30% 2.7V T/H | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers