Koupit VCO132-08IO7 s BYCHPS
Koupit se zárukou
VCO132-08IO7
- Part Number:
- VCO132-08IO7
- Výrobce:
- IXYS Corporation
- Popis:
- MOD THYRISTOR 800V 130A ECO-PAC2
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 14243 Pieces
- Datový list:
- VCO132-08IO7.pdf
Úvod
BYCHIPS je distribuční odrůda pro VCO132-08IO7, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu VCO132-08IO7 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Off State: | 800V |
|---|---|
| Napětí - Gate Trigger (Vgt) (Max): | 1.5V |
| Struktura: | Single |
| Série: | - |
| Obal: | Bulk |
| Paket / krabice: | ECO-PAC2 |
| Provozní teplota: | -40°C ~ 130°C (TJ) |
| Počet SCR, diody: | 1 SCR |
| Typ montáže: | Chassis Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | VCO132-08IO7 |
| Rozšířený popis: | SCR Module 800V 200A Single Chassis Mount ECO-PAC2 |
| Popis: | MOD THYRISTOR 800V 130A ECO-PAC2 |
| Proud - Na státu (It (RMS)) (Max): | 200A |
| Proud - Na státu (It (AV)) (Max): | 130A |
| Proud -. Non Rep Surge 50, 60 Hz (ITSM): | 3600A, 3850A |
| Proud - přidržení (H) (Max): | 200mA |
| Proud - Gate Trigger (Igt) (Max): | 300mA |
| Email: | [email protected] |
Související díly pro VCO132-08IO7
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
VCO132-12IO7 | IXYS | MOD THYRISTOR 1200V 130A ECOPAC2 | Dotaz |
|
VCO132-16IO7 | IXYS | MOD THYRISTOR 1600V 130A ECOPAC2 | Dotaz |
|
VCO132-14IO7 | IXYS | MOD THYRISTOR 1400V 130A ECOPAC2 | Dotaz |
|
VCO132-18IO7 | IXYS | MOD THYRISTOR 1800V 130A ECOPAC2 | Dotaz |
 |
VSKH230-16 | Vishay Semiconductor Diodes Division | SCR DBL LOSCR 1600V 230A MAGNAPK | Dotaz |
|
HVL900-18IO1 | IXYS | IC CTLR AC 900A 1800V HVL | Dotaz |
|
VCA105-08IO7 | IXYS | MOD THYRISTOR 800V 105A ECO-PAC2 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers