Koupit TMSDVC5416GGUR160 s BYCHPS
Koupit se zárukou
TMSDVC5416GGUR160
- Part Number:
- TMSDVC5416GGUR160
- Výrobce:
- Popis:
- IC FIXED POINT DSP 144-BGA
- Stav volného vedení / RoHS:
- Obsahuje olověný / RoHS neodpovídající
- dostupné množství:
- 17478 Pieces
- Datový list:
- TMSDVC5416GGUR160.pdf
Úvod
BYCHIPS je distribuční odrůda pro TMSDVC5416GGUR160, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu TMSDVC5416GGUR160 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - I / O: | 3.30V |
|---|---|
| Napětí - jádro: | 1.60V |
| Typ: | Fixed Point |
| Dodavatel zařízení Package: | 144-BGA MICROSTAR (12x12) |
| Série: | TMS320C54x |
| Obal: | Tray |
| Paket / krabice: | 144-LFBGA |
| Provozní teplota: | -40°C ~ 100°C (TC) |
| On-Chip RAM: | 256kB |
| Non-Volatile Memory: | ROM (32 kB) |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | TMSDVC5416GGUR160 |
| Rozhraní: | Host Interface, McBSP |
| Popis: | IC FIXED POINT DSP 144-BGA |
| Clock Rate: | 160MHz |
| Email: | [email protected] |
Související díly pro TMSDVC5416GGUR160
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
|
TMSDVC5402PGE100G4 | Texas Instruments | IC DGTL SIGNAL PROCESSOR 144LQFP | Dotaz |
 |
MSC8254SVT800B | NXP USA Inc. | IC PROCESSOR 4-CORE 783FCBGA | Dotaz |
|
TMSDVC5409APGE16G4 | Texas Instruments | IC FIXED POINT DSP 144-LQFP | Dotaz |
|
TMS320C6670XCYPA2 | Texas Instruments | IC DSP FIX/FLOAT POINT 841FCBGA | Dotaz |
|
TMS320C5504AZCH15 | Texas Instruments | IC DSP FIXED POINT 196NFBGA | Dotaz |
|
TMS320C28342ZFEQ | Texas Instruments | IC DSP FLOATING POINT 256BGA | Dotaz |
|
TMS320VC5409ZGU100 | Texas Instruments | IC FIXED POINT DSP 144-BGA | Dotaz |
 |
ADSP-BF537KBCZ-6BV | Analog Devices Inc. | IC DSP CTLR 16BIT 208CSBGA | Dotaz |
 |
Z8937120VSG | Zilog | DSP 20MHZ 44-PLCC | Dotaz |
 |
CS495002-CQZ | Cirrus Logic Inc. | IC MLTSTNDRD 32-BIT DCDR & PRGRM | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers