Koupit TDA10026HN/C1,518 s BYCHPS
Koupit se zárukou
TDA10026HN/C1,518
- Part Number:
- TDA10026HN/C1,518
- Výrobce:
- NXP Semiconductors / Freescale
- Popis:
- IC DEMODULATOR SGL 64-HVQFN
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 19973 Pieces
- Datový list:
- TDA10026HN/C1,518.pdf
Úvod
BYCHIPS je distribuční odrůda pro TDA10026HN/C1,518, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu TDA10026HN/C1,518 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Demodulator |
|---|---|
| Dodavatel zařízení Package: | 64-HVQFN (9x9) |
| Série: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 64-VFQFN Dual Rows Exposed Pad |
| Ostatní jména: | 935295976518 TDA10026HNC1518 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní standardní doba výroby: | 13 Weeks |
| Výrobní číslo výrobce: | TDA10026HN/C1,518 |
| Popis: | IC DEMODULATOR SGL 64-HVQFN |
| Aplikace: | Set-Top Boxes |
| Email: | [email protected] |
Související díly pro TDA10026HN/C1,518
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
TDA10027HN/C1,518 | NXP USA Inc. | IC DEMOD DUAL W/RX 64-HVQFN | Dotaz |
 |
TDA10025HN/C1,557 | NXP USA Inc. | IC DEMODULATOR DUAL 48-HVQFN | Dotaz |
|
TDA10026HN/C1,557 | NXP USA Inc. | IC DEMODULATOR SGL 64-HVQFN | Dotaz |
|
TDA10027HN/C1,551 | NXP USA Inc. | IC DEMOD DUAL W/RX 64-HVQFN | Dotaz |
|
TDA10026HN/C1,551 | NXP USA Inc. | IC DEMODULATOR SGL 64-HVQFN | Dotaz |
 |
TDA1013B/N2,112 | NXP USA Inc. | IC AMP AUDIO PWR 4.2W MONO 9SIL | Dotaz |
|
TDA10025HN/C1,551 | NXP USA Inc. | IC DEMODULATOR DUAL 48-HVQFN | Dotaz |
|
TDA10025HN/C1,518 | NXP USA Inc. | IC DEMODULATOR DUAL 48-HVQFN | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers