Koupit STGIPS10K60A2 s BYCHPS
Koupit se zárukou
STGIPS10K60A2
- Part Number:
- STGIPS10K60A2
- Výrobce:
- ST
- Popis:
- MOD IPM 600V 10A 25-SDIP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12273 Pieces
- Datový list:
- STGIPS10K60A2.pdf
Úvod
BYCHIPS je distribuční odrůda pro STGIPS10K60A2, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu STGIPS10K60A2 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Izolace: | 2500Vrms |
|---|---|
| Napětí: | 600V |
| Typ: | IGBT |
| Série: | SLLIMM™ |
| Paket / krabice: | 25-PowerDIP Module (0.993", 25.23mm) |
| Ostatní jména: | 497-15127-5 |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | STGIPS10K60A2 |
| Rozšířený popis: | Power Driver Module IGBT 3 Phase 600V 10A 25-PowerDIP Module (0.993", 25.23mm) |
| Popis: | MOD IPM 600V 10A 25-SDIP |
| Aktuální: | 10A |
| Konfigurace: | 3 Phase |
| Email: | [email protected] |
Související díly pro STGIPS10K60A2
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
STGIPS10K60T-H | STMicroelectronics | MOD IGBT SLLIMM 10A 600V 25SDIP | Dotaz |
|
STGIPS10C60 | STMicroelectronics | MOD IPM SLLIMM 10A 600V 25SDIP | Dotaz |
|
STGIPS10K60T | STMicroelectronics | MOD IPM 600V 10A 25-SDIP | Dotaz |
|
STGIPS14K60T-H | STMicroelectronics | MOD IGBT SLLIMM 14A 600V 25SDIP | Dotaz |
 |
STGIPS10K60A | STMicroelectronics | MOD IPM 600V 10A 25-SDIP | Dotaz |
|
STGIPS10C60-H | STMicroelectronics | MOD IPM SLLIMM 10A 600V 25SDIP | Dotaz |
|
STGIPS14K60 | STMicroelectronics | IGBT IPM MODULE 12A 600V 25SDIP | Dotaz |
|
STGIPS10C60T-H | STMicroelectronics | MOD IPM SLLIMM 3PHASE 25SDIP | Dotaz |
|
STGIPS15C60 | STMicroelectronics | MOD IGBT SLLIMM 15A 600V 25SDIP | Dotaz |
|
STGIPS15C60T-H | STMicroelectronics | MOD IPM SLLIMM 3PHASE 25SDIP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog