Koupit STBP110ETDJ6F s BYCHPS
Koupit se zárukou
STBP110ETDJ6F
- Part Number:
- STBP110ETDJ6F
- Výrobce:
- ST
- Popis:
- IC OVP PROTECTION POWERFLAT2X2
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12627 Pieces
- Datový list:
- STBP110ETDJ6F.pdf
Úvod
BYCHIPS je distribuční odrůda pro STBP110ETDJ6F, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu STBP110ETDJ6F e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Pracovní: | 28V |
|---|---|
| Napětí - Upínací: | - |
| Technika: | Internal Switch |
| Dodavatel zařízení Package: | 8-TDFN (2x2) |
| Série: | - |
| Příkon (W): | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 8-WFDFN Exposed Pad |
| Ostatní jména: | 497-13147-2 |
| Počet okruhů: | 1 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | STBP110ETDJ6F |
| Popis: | IC OVP PROTECTION POWERFLAT2X2 |
| Aplikace: | General Purpose |
| Email: | [email protected] |
Související díly pro STBP110ETDJ6F
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
|
STBP110GTDJ6F | STMicroelectronics | IC OVP PROTECTION POWERFLAT2X2 | Dotaz |
|
STBP120DVDK6F | STMicroelectronics | IC OVP W/THERMAL SHUTDOWN 10TDFN | Dotaz |
|
STBP112CVDJ6F | STMicroelectronics | IC OVP PROTECTION TDFN-8 | Dotaz |
|
STBP110CVDJ6F | STMicroelectronics | IC OVP PROTECTION POWERFLAT2X2 | Dotaz |
|
STBP120AVDK6F | STMicroelectronics | IC OVP W/THERMAL SHUTDOWN 10TDFN | Dotaz |
|
STBP120BVDK6F | STMicroelectronics | IC OVP W/THERMAL SHUTDOWN 10TDFN | Dotaz |
|
STBP120CVDK6F | STMicroelectronics | IC OVP W/THERMAL SHUTDOWN 10TDFN | Dotaz |
 |
LT4363IDE-1#PBF | Linear Technology | IC SURGE STOPPER HV 12-DFN | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers