Koupit STAC2933 s BYCHPS
Koupit se zárukou
STAC2933
- Part Number:
- STAC2933
- Výrobce:
- ST
- Popis:
- MOSF RF N CH 130V 40A STAC177B
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16996 Pieces
- Datový list:
- STAC2933.pdf
Úvod
BYCHIPS je distribuční odrůda pro STAC2933, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu STAC2933 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Test: | 50V |
|---|---|
| Napětí - Jmenovitá: | 130V |
| Transistor Type: | N-Channel |
| Dodavatel zařízení Package: | STAC177B |
| Série: | - |
| Power - Výstup: | 400W |
| Obal: | Bulk |
| Paket / krabice: | STAC177B |
| Ostatní jména: | 497-13572 |
| hluk Obrázek: | - |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | STAC2933 |
| Získat: | 23.5dB |
| Frekvence: | 30MHz |
| Rozšířený popis: | RF Mosfet N-Channel 50V 250mA 30MHz 23.5dB 400W STAC177B |
| Popis: | MOSF RF N CH 130V 40A STAC177B |
| Jmenovitá hodnota proudu: | 40A |
| Aktuální - Test: | 250mA |
| Email: | [email protected] |
Související díly pro STAC2933
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
STAC2942B | STMicroelectronics | TRANS RF PWR N-CH 350W STAC244B | Dotaz |
 |
STAC2932B | STMicroelectronics | TRANS RF PWR N-CH 300W STAC244B | Dotaz |
 |
STAC2943 | STMicroelectronics | MOSF RF N CH 130V 40A STAC177B | Dotaz |
 |
STAC2942FW | STMicroelectronics | TRANS RF PWR N-CH 350W STAC244B | Dotaz |
|
STAC2932F | STMicroelectronics | TRANS RF PWR N-CH STAC244F | Dotaz |
 |
STAC2932BW | STMicroelectronics | TRANS RF PWR N-CH 300W STAC244B | Dotaz |
 |
STAC250V2-500E | STMicroelectronics | TRANS RF 500W 250V STAC177B | Dotaz |
|
STAC2932FW | STMicroelectronics | TRANS RF PWR N-CH 300W STAC244B | Dotaz |
|
STAC2942BW | STMicroelectronics | TRANS RF PWR N-CH 350W STAC244B | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers