Koupit SPAKDSP311VF150 s BYCHPS
Koupit se zárukou
SPAKDSP311VF150
- Part Number:
- SPAKDSP311VF150
- Výrobce:
- NXP Semiconductors / Freescale
- Popis:
- IC DSP 24BIT 196-MAPBGA
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12491 Pieces
- Datový list:
- 1.SPAKDSP311VF150.pdf2.SPAKDSP311VF150.pdf
Úvod
BYCHIPS je distribuční odrůda pro SPAKDSP311VF150, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu SPAKDSP311VF150 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - I / O: | 3.30V |
|---|---|
| Napětí - jádro: | 1.80V |
| Typ: | Fixed Point |
| Dodavatel zařízení Package: | 196-MAPBGA (15x15) |
| Série: | DSP56K/Symphony |
| Obal: | Tray |
| Paket / krabice: | 196-LBGA |
| Provozní teplota: | -40°C ~ 105°C (TJ) |
| On-Chip RAM: | 384kB |
| Non-Volatile Memory: | ROM (576 B) |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní číslo výrobce: | SPAKDSP311VF150 |
| Rozhraní: | Host Interface, SSI, SCI |
| Popis: | IC DSP 24BIT 196-MAPBGA |
| Clock Rate: | 150MHz |
| Email: | [email protected] |
Související díly pro SPAKDSP311VF150
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
SPAKDSP321VF275 | NXP USA Inc. | IC DSP 24BIT 196-MAPBGA | Dotaz |
 |
ADSP-21060LKSZ-160 | Analog Devices Inc. | IC DSP CONTROLLER 32BIT 240MQFP | Dotaz |
|
SPAKDSP311VL150 | NXP USA Inc. | IC DSP 24BIT 150MHZ 196-MAPBGA | Dotaz |
|
SPAKDSP321VL275 | NXP USA Inc. | IC DSP 24BIT 275MHZ 196-MAPBGA | Dotaz |
 |
SPAKDSP303AG100 | NXP USA Inc. | IC DSP 24BIT 100MHZ 144-LQFP | Dotaz |
|
SPAKDSP303VL100 | NXP USA Inc. | IC DSP 24BIT 100MHZ 196-MAPBGA | Dotaz |
|
SPAKDSP321VF240 | NXP USA Inc. | IC DSP 24BIT 196-MAPBGA | Dotaz |
 |
TMS32C6416EZLZ6E3 | Texas Instruments | IC FIXED POINT DSP 532-FCBGA | Dotaz |
|
SPAKDSP303VF100 | NXP USA Inc. | IC DSP 24BIT 100MHZ 196-MAPBGA | Dotaz |
|
SPAKDSP321VL240 | NXP USA Inc. | IC DSP 24BIT 240MHZ 196-MAPBGA | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers