Koupit SL1021A145RS s BYCHPS
Koupit se zárukou
SL1021A145RS
- Part Number:
- SL1021A145RS
- Výrobce:
- Littelfuse
- Popis:
- GDT 145V 10KA THROUGH HOLE
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17372 Pieces
- Datový list:
- SL1021A145RS.pdf
Úvod
BYCHIPS je distribuční odrůda pro SL1021A145RS, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu SL1021A145RS e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - DC Spark Over (nom): | 145V |
|---|---|
| Tolerance: | - |
| Série: | SL1021A |
| Obal: | Tray |
| Paket / krabice: | Axial Cylinder, 3 Lead (Radial Bend) |
| Počet pólů: | 3 |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | SL1021A145RS |
| Impulsní výbojový proud (8 / 20μs): | 10000A (10kA) |
| selhání Short: | No |
| Rozšířený popis: | Gas Discharge Tube 10000A (10kA) 3 Pole Through Hole |
| Popis: | GDT 145V 10KA THROUGH HOLE |
| Email: | [email protected] |
Související díly pro SL1021A145RS
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
SL1021A145C | Littelfuse Inc. | GDT 145V 10KA | Dotaz |
 |
SL1021A145RF | Littelfuse Inc. | GDT 145V 10KA T/H FAIL SHORT | Dotaz |
|
SL1021A145R | Littelfuse Inc. | GDT 145V 10KA THROUGH HOLE | Dotaz |
|
SL1021A150R | Littelfuse Inc. | GDT 150V 10KA THROUGH HOLE | Dotaz |
|
SL1021A150RS | Littelfuse Inc. | GDT 200V 10KA THROUGH HOLE | Dotaz |
|
SL1021A145RG | Littelfuse Inc. | GDT 145V 10KA T/H FAIL SHORT | Dotaz |
|
SL1021A150C | Littelfuse Inc. | GDT 150V 10KA | Dotaz |
 |
SL1021A600C | Littelfuse Inc. | GDT 600V 10KA | Dotaz |
|
SL1021A150RF | Littelfuse Inc. | GDT 150V 10KA T/H FAIL SHORT | Dotaz |
|
SL1021A300RG | Littelfuse Inc. | GDT 300V 10KA T/H FAIL SHORT | Dotaz |
|
SL1021A150RG | Littelfuse Inc. | GDT 150V 10KA T/H FAIL SHORT | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers