Koupit PS11015 s BYCHPS
Koupit se zárukou
PS11015
- Part Number:
- PS11015
- Výrobce:
- Powerex, Inc.
- Popis:
- MOD IPM 3PHASE IGBT 600V 20A
- Stav volného vedení / RoHS:
- Obsahuje olověný / RoHS neodpovídající
- dostupné množství:
- 14460 Pieces
- Datový list:
- PS11015.pdf
Úvod
BYCHIPS je distribuční odrůda pro PS11015, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu PS11015 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Izolace: | 2500Vrms |
|---|---|
| Napětí: | 600V |
| Typ: | IGBT |
| Série: | - |
| Paket / krabice: | 40-PowerDIP Module (2.835", 72.00mm), 33 Leads |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | PS11015 |
| Rozšířený popis: | Power Driver Module IGBT 3 Phase 600V 20A 40-PowerDIP Module (2.835", 72.00mm), 33 Leads |
| Popis: | MOD IPM 3PHASE IGBT 600V 20A |
| Aktuální: | 20A |
| Konfigurace: | 3 Phase |
| Email: | [email protected] |
Související díly pro PS11015
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
PS11032 | Powerex Inc. | MOD IPM 3PHASE IGBT 600V 4A | Dotaz |
 |
PS11033 | Powerex Inc. | MOD IPM 3PHASE IGBT 600V 8A | Dotaz |
|
PS11013 | Powerex Inc. | MOD IPM 3PHASE IGBT 600V 8A | Dotaz |
|
PS11012 | Powerex Inc. | MOD IPM 3PHASE IGBT 600V 4A | Dotaz |
 |
PS11037 | Powerex Inc. | MOD IPM 3PHASE IGBT 600V 50A | Dotaz |
|
PS11017 | Powerex Inc. | MOD IPM 3PHASE IGBT 600V 50A | Dotaz |
|
PS11036 | Powerex Inc. | MOD IPM 3PHASE IGBT 600V 30A | Dotaz |
|
STGIPS20C60-H | STMicroelectronics | MOD IPM SLLIMM 20A 600V 25SDIP | Dotaz |
|
PS11016 | Powerex Inc. | MOD IPM 3PHASE IGBT 600V 30A | Dotaz |
|
PS11011 | Powerex Inc. | MOD IPM 3PHASE IGBT 600V 2A | Dotaz |
|
PS11014 | Powerex Inc. | MOD IPM 3PHASE IGBT 600V 15A | Dotaz |
|
PS11034 | Powerex Inc. | MOD IPM 3PHASE IGBT 600V 15A | Dotaz |
 |
BM63764S-VA | Rohm Semiconductor | IC IPM 600V IGBT SW 25HSDIP | Dotaz |
|
PS11035 | Powerex Inc. | MOD IPM 3PHASE IGBT 600V 20A | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers