Koupit MB85R256GPF-G-BND-ERE1 s BYCHPS
Koupit se zárukou
MB85R256GPF-G-BND-ERE1
- Part Number:
- MB85R256GPF-G-BND-ERE1
- Popis:
- IC FRAM 256KBIT PAR 28SOP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12201 Pieces
- Datový list:
- MB85R256GPF-G-BND-ERE1.pdf
Úvod
BYCHIPS je distribuční odrůda pro MB85R256GPF-G-BND-ERE1, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu MB85R256GPF-G-BND-ERE1 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 2.7 V ~ 3.6 V |
|---|---|
| Rychlost: | 150ns |
| Série: | - |
| Provozní teplota: | -40°C ~ 85°C (TA) |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Typ paměti: | Non-Volatile |
| Velikost paměti: | 256Kb (32K x 8) |
| Formát paměti: | FRAM |
| Výrobní číslo výrobce: | MB85R256GPF-G-BND-ERE1 |
| Rozhraní: | Parallel |
| Popis: | IC FRAM 256KBIT PAR 28SOP |
| Email: | [email protected] |
Související díly pro MB85R256GPF-G-BND-ERE1
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
MB85R256FPNF-G-JNERE2 | Fujitsu Electronics America, Inc. | IC FRAM 256KBIT 150NS 28SOP | Dotaz |
 |
MB85RS128APNF-G-JNE1 | Fujitsu Electronics America, Inc. | IC FRAM 128KBIT 25MHZ 8SOP | Dotaz |
|
MB85R256FPF-G-BNDE1 | Fujitsu Electronics America, Inc. | IC FRAM 256KBIT 150NS 28SOP | Dotaz |
|
MB85R256FPF-G-BND-ERE1 | Fujitsu Electronics America, Inc. | IC FRAM 256KBIT PAR 28SOP | Dotaz |
 |
MB85R256FPFCN-G-BNDE1 | Fujitsu Electronics America, Inc. | IC FRAM 256KBIT 150NS 28TSOP | Dotaz |
|
MB85RS256APNF-G-JNE1 | Fujitsu Electronics America, Inc. | IC FRAM 256KBIT 25MHZ 8SOP | Dotaz |
|
MB85R256GPF-G-BNDE1 | Fujitsu Electronics America, Inc. | IC FRAM 256KBIT PAR 28SOP | Dotaz |
|
MB85RS256BPNF-G-JNERE1 | Fujitsu Electronics America, Inc. | IC FRAM 256KBIT 33MHZ 8SOP | Dotaz |
|
MB85RC128PNF-G-JNE1 | Fujitsu Electronics America, Inc. | IC FRAM 128KBIT 400KHZ 8SOP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog