Koupit MAX16114W29MC+ s BYCHPS
Koupit se zárukou
MAX16114W29MC+
- Part Number:
- MAX16114W29MC+
- Výrobce:
- Maxim Integrated
- Popis:
- IC SUPERVISOR LP SOT23
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16311 Pieces
- Datový list:
- MAX16114W29MC+.pdf
Úvod
BYCHIPS je distribuční odrůda pro MAX16114W29MC+, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu MAX16114W29MC+ e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | MAX16114W29MC+ |
| Rozšířený popis: | Supervisor Channel |
| Popis: | IC SUPERVISOR LP SOT23 |
| Email: | [email protected] |
Související díly pro MAX16114W29MC+
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
MAX16118A2916CA+ | Maxim Integrated | IC SUPERVISOR LOW POWER SOT-23 | Dotaz |
 |
MAX16114O16MC+T | Maxim Integrated | IC SUPERVISOR LOW POWER SOT-23 | Dotaz |
|
MAX16116H2307MC+T | Maxim Integrated | IC SUPERVISOR LP SOT23 | Dotaz |
|
MAX16115O16MC+T | Maxim Integrated | IC SUPERVISOR LOW POWER SOT-23 | Dotaz |
|
MAX16114W29MC+T | Maxim Integrated | IC SUPERVISOR LP SOT23 | Dotaz |
|
MAX16119H2307MC+T | Maxim Integrated | IC SUPERVISOR LOW POWER SOT-23 | Dotaz |
|
MAX16114Q17MA+T | Maxim Integrated | LP SUPERVISORY CIRCUITS | Dotaz |
 |
MAX16127TC+T | Maxim Integrated | IC LOAD DUMP REV V PROT 12TQFN | Dotaz |
|
MAX16112H3110IA+ | Maxim Integrated | IC SUPERVISOR LP SOT23 | Dotaz |
|
MAX16116H2307MC+ | Maxim Integrated | IC SUPERVISOR LP SOT23 | Dotaz |
|
MAX16118A2916CA+T | Maxim Integrated | IC SUPERVISOR LP SOT23 | Dotaz |
|
MAX16112H3110IA+T | Maxim Integrated | IC SUPERVISOR LP SOT23 | Dotaz |
|
MAX16126TCA+T | Maxim Integrated | IC LOAD DUMP REV V PROT 12TQFN | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers