Koupit LM9822CCWM/NOPB s BYCHPS
Koupit se zárukou
LM9822CCWM/NOPB
- Part Number:
- LM9822CCWM/NOPB
- Výrobce:
- Popis:
- IC SCANNER COLOR ANALOG 28-SOIC
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13148 Pieces
- Datový list:
- LM9822CCWM/NOPB.pdf
Úvod
BYCHIPS je distribuční odrůda pro LM9822CCWM/NOPB, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu LM9822CCWM/NOPB e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Dodavatel zařízení Package: | 28-SOIC |
|---|---|
| Série: | * |
| Obal: | Tube |
| Paket / krabice: | 28-SOIC (0.295", 7.50mm Width) |
| Ostatní jména: | *LM9822CCWM *LM9822CCWM/NOPB 296-39778-5 LM9822CCWM LM9822CCWM-ND LM9822CCWM/NOPB-ND |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní standardní doba výroby: | 6 Weeks |
| Výrobní číslo výrobce: | LM9822CCWM/NOPB |
| Rozšířený popis: | IC 28-SOIC |
| Popis: | IC SCANNER COLOR ANALOG 28-SOIC |
| Email: | [email protected] |
Související díly pro LM9822CCWM/NOPB
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
CTST571QG | CTS-Frequency Controls | PROGRAM CAPACITIVE TUNING IC | Dotaz |
 |
CAP013DG | Power Integrations | IC CAP DISCHRG 1000V 750NF 8SOIC | Dotaz |
 |
MAX4507EAP | Maxim Integrated | IC SIGNAL LINE PROTECTOR 20-SSOP | Dotaz |
 |
MAX4845EYT+ | Maxim Integrated | IC CTLR OVP 5.8V 6-UTLGA | Dotaz |
|
LM9822CCWMX/NOPB | Texas Instruments | IC SCANNER COLR 3CH 42BIT 28SOIC | Dotaz |
 |
ADATE302-02BSVZ | Analog Devices Inc. | IC DCL ATE 500MHZ DUAL 100TQFP | Dotaz |
 |
ISL59450IQZ | Intersil | IC SWITCH VID CRSSPNT 128-MQFP | Dotaz |
|
DS34T104GN | Maxim Integrated | IC TDM/PACKET CHIP 484-BGA | Dotaz |
 |
SLB9656TT12FW432XUMA2 | Infineon Technologies | SECURITY IC'S/AUTHENTICATION IC' | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers