Koupit LGN2V181MELA25 s BYCHPS
Koupit se zárukou
LGN2V181MELA25
- Part Number:
- LGN2V181MELA25
- Výrobce:
- Nichicon
- Popis:
- CAP ALUM 180UF 20% 350V SNAP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16125 Pieces
- Datový list:
- 1.LGN2V181MELA25.pdf2.LGN2V181MELA25.pdf
Úvod
BYCHIPS je distribuční odrůda pro LGN2V181MELA25, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu LGN2V181MELA25 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| napìtí: | 350V |
|---|---|
| Tolerance: | ±20% |
| Povrchová montáž Land Velikost: | - |
| Velikost / Rozměry: | 0.984" Dia (25.00mm) |
| Série: | LGN |
| Ripple Current: | 900mA @ 120Hz |
| Polarizace: | Polar |
| Obal: | Bulk |
| Paket / krabice: | Radial, Can - Snap-In |
| Ostatní jména: | 493-8343 LGN2V181MELA25-ND |
| Provozní teplota: | -25°C ~ 105°C |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 25 Weeks |
| Výrobní číslo výrobce: | LGN2V181MELA25 |
| Životnost @ Temp.: | 3000 Hrs @ 105°C |
| Rozestup vývodù: | 0.394" (10.00mm) |
| Impedance: | - |
| Výška - Sedící (Max): | 1.063" (27.00mm) |
| Rozšířený popis: | 180µF 350V Aluminum Capacitors Radial, Can - Snap-In 3000 Hrs @ 105°C |
| ESR (Equivalent Resistance Series): | - |
| Popis: | CAP ALUM 180UF 20% 350V SNAP |
| kapacitní: | 180µF |
| Aplikace: | General Purpose |
| Email: | [email protected] |
Související díly pro LGN2V181MELA25
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
LGN2V331MELZ45 | Nichicon | CAP ALUM 330UF 20% 350V SNAP | Dotaz |
 |
LGN2V181MELZ30 | Nichicon | CAP ALUM 180UF 20% 350V SNAP | Dotaz |
 |
LGN2V681MELC40 | Nichicon | CAP ALUM 680UF 20% 350V SNAP | Dotaz |
 |
LGN2V271MELA35 | Nichicon | CAP ALUM 270UF 20% 350V SNAP | Dotaz |
 |
LGN2V561MELC35 | Nichicon | CAP ALUM 560UF 20% 350V SNAP | Dotaz |
 |
LGN2V391MELA45 | Nichicon | CAP ALUM 390UF 20% 350V SNAP | Dotaz |
 |
LGN2V221MELA30 | Nichicon | CAP ALUM 220UF 20% 350V SNAP | Dotaz |
 |
LGN2V331MELA40 | Nichicon | CAP ALUM 330UF 20% 350V SNAP | Dotaz |
 |
LGN2V561MELB45 | Nichicon | CAP ALUM 560UF 20% 350V SNAP | Dotaz |
|
LGN2V151MELZ30 | Nichicon | CAP ALUM 150UF 20% 350V SNAP | Dotaz |
 |
LGN2V121MELZ25 | Nichicon | CAP ALUM 120UF 20% 350V SNAP | Dotaz |
|
LGN2V331MELB30 | Nichicon | CAP ALUM 330UF 20% 350V SNAP | Dotaz |
|
LGN2V471MELB40 | Nichicon | CAP ALUM 470UF 20% 350V SNAP | Dotaz |
 |
LGN2V471MELC30 | Nichicon | CAP ALUM 470UF 20% 350V SNAP | Dotaz |
|
LGN2V271MELB25 | Nichicon | CAP ALUM 270UF 20% 350V SNAP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers