Koupit KMC8113TVT4800V s BYCHPS
Koupit se zárukou
KMC8113TVT4800V
- Part Number:
- KMC8113TVT4800V
- Výrobce:
- NXP Semiconductors / Freescale
- Popis:
- IC DSP 300/400MHZ 431FCBGA
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17430 Pieces
- Datový list:
- KMC8113TVT4800V.pdf
Úvod
BYCHIPS je distribuční odrůda pro KMC8113TVT4800V, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu KMC8113TVT4800V e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - I / O: | 3.30V |
|---|---|
| Napětí - jádro: | 1.10V |
| Typ: | SC140 Core |
| Dodavatel zařízení Package: | 431-FCPBGA (20x20) |
| Série: | StarCore |
| Obal: | Tray |
| Paket / krabice: | 431-BFBGA, FCBGA |
| Provozní teplota: | -40°C ~ 105°C (TJ) |
| On-Chip RAM: | 1.436MB |
| Non-Volatile Memory: | External |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní číslo výrobce: | KMC8113TVT4800V |
| Rozhraní: | Ethernet, I²C, TDM, UART |
| Popis: | IC DSP 300/400MHZ 431FCBGA |
| Clock Rate: | 400MHz |
| Email: | [email protected] |
Související díly pro KMC8113TVT4800V
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
KMC8113TVT3600V | NXP USA Inc. | IC DSP 300/400MHZ 431FCBGA | Dotaz |
|
KMC8113TMP3600V | NXP USA Inc. | IC DSP 300/400MHZ 431FCBGA | Dotaz |
|
KMC8113TMP4800V | NXP USA Inc. | IC DSP 300/400MHZ 431FCBGA | Dotaz |
 |
KMC8144TVT800A | NXP USA Inc. | IC DSP 783FCBGA | Dotaz |
|
KMC8112TMP2400V | NXP USA Inc. | IC DSP 300MHZ 431FCBGA | Dotaz |
|
KMC8144SVT800B | NXP USA Inc. | IC DSP 783FCBGA | Dotaz |
|
KMC8144VT800A | NXP USA Inc. | IC DSP 783FCBGA | Dotaz |
|
KMC8144VT1000B | NXP USA Inc. | IC DSP 783FCBGA | Dotaz |
|
KMC8144SVT1000A | NXP USA Inc. | IC DSP 783FCBGA | Dotaz |
|
KMC8144TVT1000B | NXP USA Inc. | IC DSP 783FCBGA | Dotaz |
|
KMC8112TVT2400V | NXP USA Inc. | IC DSP 300MHZ 431FCBGA | Dotaz |
|
KMC8144SVT800A | NXP USA Inc. | IC DSP 783FCBGA | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers