Koupit IS61NLP204818A-166TQ-TR s BYCHPS
Koupit se zárukou
IS61NLP204818A-166TQ-TR
- Part Number:
- IS61NLP204818A-166TQ-TR
- Popis:
- IC SRAM 36MBIT 166MHZ 100TQFP
- Stav volného vedení / RoHS:
- Obsahuje olověný / RoHS neodpovídající
- dostupné množství:
- 19203 Pieces
- Datový list:
- IS61NLP204818A-166TQ-TR.pdf
Úvod
BYCHIPS je distribuční odrůda pro IS61NLP204818A-166TQ-TR, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu IS61NLP204818A-166TQ-TR e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 3.135 V ~ 3.465 V |
|---|---|
| Dodavatel zařízení Package: | 100-LQFP (14x20) |
| Rychlost: | 166MHz |
| Série: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 100-LQFP |
| Provozní teplota: | 0°C ~ 70°C (TA) |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Typ paměti: | Volatile |
| Velikost paměti: | 36Mb (2M x 18) |
| Formát paměti: | SRAM |
| Výrobní číslo výrobce: | IS61NLP204818A-166TQ-TR |
| Rozhraní: | Parallel |
| Popis: | IC SRAM 36MBIT 166MHZ 100TQFP |
| Email: | [email protected] |
Související díly pro IS61NLP204818A-166TQ-TR
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
IS61NLP204818B-250B3L | ISSI, Integrated Silicon Solution Inc | IC SRAM 36MBIT 250MHZ 165FBGA | Dotaz |
 |
IS61NLP204818A-166TQLI-TR | ISSI, Integrated Silicon Solution Inc | IC SRAM 36MBIT 166MHZ 100TQFP | Dotaz |
|
IS61NLP204818B-250B3L-TR | ISSI, Integrated Silicon Solution Inc | IC SRAM 36MBIT 250MHZ 165FBGA | Dotaz |
|
IS61NLP204818A-166TQ | ISSI, Integrated Silicon Solution Inc | IC SRAM 36MBIT 166MHZ 100TQFP | Dotaz |
|
IS61NLP204818B-200TQLI-TR | ISSI, Integrated Silicon Solution Inc | IC SRAM 36MBIT 200MHZ 100LQFP | Dotaz |
|
IS61NLP204818B-200TQLI | ISSI, Integrated Silicon Solution Inc | IC SRAM 36MBIT 200MHZ 100LQFP | Dotaz |
|
IS61NLP204818A-166TQLI | ISSI, Integrated Silicon Solution Inc | IC SRAM 36MBIT 166MHZ 100TQFP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers