Koupit IELHB11-1REC5-70313-6 s BYCHPS
Koupit se zárukou
IELHB11-1REC5-70313-6
- Part Number:
- IELHB11-1REC5-70313-6
- Výrobce:
- Sensata Technologies, Airpax
- Popis:
- CIR BRKR MAG-HYDR LEVER 6A
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16731 Pieces
- Datový list:
- IELHB11-1REC5-70313-6.pdf
Úvod
BYCHIPS je distribuční odrůda pro IELHB11-1REC5-70313-6, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu IELHB11-1REC5-70313-6 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | - |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 6 Weeks |
| Výrobní číslo výrobce: | IELHB11-1REC5-70313-6 |
| Popis: | CIR BRKR MAG-HYDR LEVER 6A |
| Email: | [email protected] |
Související díly pro IELHB11-1REC5-70313-6
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
IELHB11-1REC5-70313-2 | Sensata Technologies/Airpax | CIR BRKR MAG-HYDR LEVER 2A | Dotaz |
|
IELHB11-1REC5-70313-10 | Sensata Technologies/Airpax | CIR BRKR MAG-HYDR LEVER 10A | Dotaz |
|
IELHB11-1REC5-70313-0.5 | Sensata Technologies/Airpax | CIR BRKR MAG-HYDR LEVER .5A | Dotaz |
|
IELHB11-1REC5-70313-8 | Sensata Technologies/Airpax | CIR BRKR MAG-HYDR LEVER 8A | Dotaz |
|
IELHB11-1REC5-70313-5 | Sensata Technologies/Airpax | CIR BRKR MAG-HYDR LEVER 5A | Dotaz |
|
IELHB11-1REC5-70313-3 | Sensata Technologies/Airpax | CIR BRKR MAG-HYDR LEVER 3A | Dotaz |
|
IELHB11-1REC5-70313-15 | Sensata Technologies/Airpax | CIR BRKR MAG-HYDR LEVER 15A | Dotaz |
|
IELHB11-1REC5-70313-1 | Sensata Technologies/Airpax | CIR BRKR MAG-HYDR LEVER 1A | Dotaz |
|
IELHB11-1REC5-70313-25 | Sensata Technologies/Airpax | CIR BRKR MAG-HYDR LEVER 25A | Dotaz |
|
IELHB11-1REC5-70313-20 | Sensata Technologies/Airpax | CIR BRKR MAG-HYDR LEVER 20A | Dotaz |
|
IELHB11-1REC5-70313-7 | Sensata Technologies/Airpax | CIR BRKR MAG-HYDR LEVER 7A | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers