Koupit HS103DR-CD4850W1U s BYCHPS
Koupit se zárukou
HS103DR-CD4850W1U
- Part Number:
- HS103DR-CD4850W1U
- Výrobce:
- Crydom
- Popis:
- SSR/HS ASSY
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13404 Pieces
- Datový list:
- HS103DR-CD4850W1U.pdf
Úvod
BYCHIPS je distribuční odrůda pro HS103DR-CD4850W1U, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu HS103DR-CD4850W1U e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 8 Weeks |
| Výrobní číslo výrobce: | HS103DR-CD4850W1U |
| Rozšířený popis: | Solid State |
| Popis: | SSR/HS ASSY |
| Email: | [email protected] |
Související díly pro HS103DR-CD4850W1U
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
HS103DR-MCPC4890C | Crydom Co. | SSR/HS ASSY | Dotaz |
|
HS103-D1240-B | Crydom Co. | SSR/HS ASSY | Dotaz |
 |
HS103DR-D2490 | Crydom Co. | RELAY SSR SPST 55A W/HEATSINK ZC | Dotaz |
|
HS103DR-HD6090 | Crydom Co. | RELAY SSR SPST 55A W/HEATSINK ZC | Dotaz |
 |
HS103DR | Crydom Co. | HEATSINK SSR 1.0DEG C/W DIN MNT | Dotaz |
 |
84140213 | Crydom Co. | RELAY DUAL 40A 240V ZC 17-32VDC | Dotaz |
|
HS103-3DC60D100 | Crydom Co. | SSR/HS ASSY | Dotaz |
 |
PR29MF21NSZF | Sharp Microelectronics | RELAY SSR 120VAC .9A ZC 8-DIP | Dotaz |
|
HS103DR-D53TP50D | Crydom Co. | SSR/HS ASSY | Dotaz |
|
HS103DR-D53TP25D | Crydom Co. | RELAY SSR SPST 55A W/HEATSINK ZC | Dotaz |
 |
G3RV-SR500-D AC100 | Omron Automation and Safety | RELAY SSR SPST-NO 3A 100VAC | Dotaz |
 |
HS103 | Crydom Co. | HEATSINK SSR 1.0DEG C/W PNL MNT | Dotaz |
 |
MCTC2490KLA | Crydom Co. | CTRLR TEMP SSR 240V 90A AC OUT | Dotaz |
 |
LH1523BB | Vishay Semiconductor Opto Division | DIP-8 SSR DUAL 1 FORM B | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers