Koupit HKP-JJ s BYCHPS
Koupit se zárukou
HKP-JJ
- Part Number:
- HKP-JJ
- Výrobce:
- Bussmann (Eaton)
- Popis:
- FUSE HOLDER 250V
- Stav volného vedení / RoHS:
- Obsahuje olověný / RoHS neodpovídající
- dostupné množství:
- 15698 Pieces
- Datový list:
- HKP-JJ.pdf
Úvod
BYCHIPS je distribuční odrůda pro HKP-JJ, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu HKP-JJ e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 7 Weeks |
| Výrobní číslo výrobce: | HKP-JJ |
| Rozšířený popis: | Fuse Circuit |
| Popis: | FUSE HOLDER 250V |
| Email: | [email protected] |
Související díly pro HKP-JJ
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
HKP-EL-ZZ | Eaton | FUSE HOLDER 250V | Dotaz |
|
HKP-1K0957 | Eaton | FUSE HOLDER 250V | Dotaz |
|
HKP-EW | Eaton | FUSE HOLDER 250V | Dotaz |
 |
HKP-BBHH-R | Eaton | FUSE HLDR CART 250V 15A PNL MNT | Dotaz |
 |
HKP-HH-R | Eaton | FUSE HLDR CART 250V 15A PNL MNT | Dotaz |
 |
HKP-L-BB | Eaton | FUSE HOLDER 250V | Dotaz |
|
HKP-J | Eaton | FUSE HOLDER 250V | Dotaz |
|
HKP-L-HH | Eaton | FUSE HOLDER 250V | Dotaz |
|
HKP | Eaton | FUSE HLDR CART 250V 30A PNL MNT | Dotaz |
|
HKP-OO-R | Eaton | FUSE HLDR CART 250V 30A PNL MNT | Dotaz |
|
HKP-W-R | Eaton | FUSE HLDR CART 250V 30A PNL MNT | Dotaz |
|
HKP-1K0455 | Eaton | FUSE HOLDER 250V | Dotaz |
|
HKP-ELN-BB | Eaton | FUSE HOLDER 250V | Dotaz |
|
HKP-HJRW-AABBZZ | Eaton | FUSE HOLDER 250V | Dotaz |
|
HKP-L-R | Eaton | FUSE HLDR CART 250V 30A PNL MNT | Dotaz |
|
HKP-1K0962 | Eaton | FUSE HOLDER 250V | Dotaz |
|
HKP-R | Eaton | FUSE HLDR CART 250V 30A PNL MNT | Dotaz |
|
HKP-BB-R | Eaton | FUSE HLDR CART 250V 15A PNL MNT | Dotaz |
|
HKP-1K0406 | Eaton | FUSE HOLDER 250V | Dotaz |
|
HKP-1K0965 | Eaton | FUSE HOLDER 250V | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers