Koupit GXC13003 s BYCHPS
Koupit se zárukou
GXC13003
- Part Number:
- GXC13003
- Výrobce:
- Sprague Goodman
- Popis:
- CAP TRIM 2-13PF 100V THRU HOLE
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15967 Pieces
- Datový list:
- GXC13003.pdf
Úvod
BYCHIPS je distribuční odrůda pro GXC13003, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu GXC13003 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 100V |
|---|---|
| Velikost / Rozměry: | 0.433" L x 0.374" W (11.00mm x 9.50mm) |
| Série: | - |
| Obal: | Bulk |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | GXC13003 |
| Výška - Sedící (Max): | 0.402" (10.20mm) |
| Funkce: | General Purpose |
| Rozšířený popis: | 2 ~ 13pF Trimmer Capacitor 100V Top and Bottom Adjustment Through Hole |
| Popis: | CAP TRIM 2-13PF 100V THRU HOLE |
| Rozsah kapacitního: | 2 ~ 13pF |
| Typ úpravy: | Top and Bottom Adjustment |
| Email: | [email protected] |
Související díly pro GXC13003
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
GXC13000 | Sprague-Goodman | CAP TRIM 2-13PF 100V THRU HOLE | Dotaz |
|
GXC13004 | Sprague-Goodman | CAP TRIM 2-13PF 100V THRU HOLE | Dotaz |
|
GNR4R550 | Sprague-Goodman | CAP TRIM 0.6-4.5PF 500V | Dotaz |
 |
0538-006-F-15.0-60 | Tusonix a Subsidiary of CTS Electronic Components | TRIMMER | Dotaz |
|
GGN18033 | Sprague-Goodman | CAP TRIM 0.8-18PF 750V SURF MNT | Dotaz |
 |
GKY10066 | Sprague-Goodman | CAP TRIMMER 3-10PF 100V SMD | Dotaz |
|
GMD20500 | Sprague-Goodman | CAP TRIM 16-90PF 175V THRU HOLE | Dotaz |
|
GGC12000 | Sprague-Goodman | CAP TRIMMER TH | Dotaz |
|
GGV30000 | Sprague-Goodman | CAP TRIM 0.8-30PF 1.25KV T/H | Dotaz |
|
SGNMNC2356E | Sprague-Goodman | CAP TRIM 3.5-35PF 6KV CHASS MNT | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers