Koupit GS3140-INE3 s BYCHPS
Koupit se zárukou
GS3140-INE3
- Part Number:
- GS3140-INE3
- Výrobce:
- Semtech
- Popis:
- IC EQUALIZER 3G SDI ADAPTIV 16FN
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 19898 Pieces
- Datový list:
- 1.GS3140-INE3.pdf2.GS3140-INE3.pdf
Úvod
BYCHIPS je distribuční odrůda pro GS3140-INE3, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu GS3140-INE3 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Equalizer |
|---|---|
| Dodavatel zařízení Package: | 16-QFN (4x4) |
| Série: | - |
| Obal: | Tray |
| Paket / krabice: | 16-VQFN |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní číslo výrobce: | GS3140-INE3 |
| Popis: | IC EQUALIZER 3G SDI ADAPTIV 16FN |
| Aplikace: | AES10, SMPTE ST 259, 292, 424 |
| Email: | [email protected] |
Související díly pro GS3140-INE3
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
FMS6410CSX | Fairchild/ON Semiconductor | IC FILTER VIDEO DUAL 8-SOIC | Dotaz |
 |
GS3140-INTE3Z | Semtech Corporation | IC CABLE EQUALIZER SMPTE 16QFN | Dotaz |
 |
SN761672ADAR | Texas Instruments | IC ANALOG TV/VCR TUNER 32-TSSOP | Dotaz |
|
LMH0307GR/NOPB | Texas Instruments | IC CBL DVR DUAL 3G HD/SD 25-UARY | Dotaz |
|
GS3140-INTE3 | Semtech Corporation | IC EQUALIZER 3G SDI ADAPTIV 16FN | Dotaz |
|
SN761677DA | Texas Instruments | IC TV/VCR TUNER W/CONVRT 38TSSOP | Dotaz |
|
LMH1218RTWR | Texas Instruments | IC RECLOCKER UHD 12.5GBS 24WQFN | Dotaz |
 |
EL1883ISZ | Intersil | IC VIDEO SYNC SEPARATOR 8SOIC | Dotaz |
 |
SI21672-B22-GMR | Silicon Labs | IC DEMODULATOR DVB-S2/S/T/C 68QF | Dotaz |
|
VSP2210Y | Texas Instruments | IC CCD SIGNAL PROC/SCAN 48-LQFP | Dotaz |
|
TW9984AT-NA1-GE | Intersil | IC VIDEO DECODER 68QFN | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers