Koupit CAY16-392J8LF s BYCHPS
Koupit se zárukou
CAY16-392J8LF
- Part Number:
- CAY16-392J8LF
- Výrobce:
- Bourns, Inc.
- Popis:
- RES ARRAY 8 RES 3.9K OHM 1506
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15199 Pieces
- Datový list:
- CAY16-392J8LF.pdf
Úvod
BYCHIPS je distribuční odrůda pro CAY16-392J8LF, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu CAY16-392J8LF e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Tolerance: | ±5% |
|---|---|
| teplotní koeficient: | ±200ppm/°C |
| Dodavatel zařízení Package: | 1506 |
| Velikost / Rozměry: | 0.150" L x 0.063" W (3.80mm x 1.60mm) |
| Série: | CAY16 |
| Odpor (Ohm): | 3.9k |
| Power Per Element: | 62.5mW |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 1506, Convex, Long Side Terminals |
| Provozní teplota: | -55°C ~ 125°C |
| Počet rezistory: | 8 |
| Počet Pins: | 16 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 15 Weeks |
| Výrobní číslo výrobce: | CAY16-392J8LF |
| Výška - Sedící (Max): | 0.024" (0.60mm) |
| Rozšířený popis: | 3.9k Ohm ±5% 62.5mW Power Per Element Isolated Resistor Network/Array ±200ppm/°C 1506, Convex, Long Side Terminals |
| Popis: | RES ARRAY 8 RES 3.9K OHM 1506 |
| Typ obvodu: | Isolated |
| Aplikace: | - |
| Email: | [email protected] |
Související díly pro CAY16-392J8LF
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
CAY16-6801F4LF | Bourns Inc. | RES ARRAY 4 RES 6.8K OHM 1206 | Dotaz |
|
CAY16-2740F4LF | Bourns Inc. | RES ARRAY 4 RES 274 OHM 1206 | Dotaz |
|
CAY16-2212F4LF | Bourns Inc. | RES ARRAY 4 RES 22.1K OHM 1206 | Dotaz |
 |
CAY16-182J8LF | Bourns Inc. | RES ARRAY 8 RES 1.8K OHM 1506 | Dotaz |
|
CAY16-1502F4LF | Bourns Inc. | RES ARRAY 4 RES 15K OHM 1206 | Dotaz |
 |
CAY16-180J2LF | Bourns Inc. | RES ARRAY 2 RES 18 OHM 0606 | Dotaz |
|
CAY16-103J4GLF | Bourns Inc. | RES ARRAY 4 RES 10K OHM 1206 | Dotaz |
|
CAY16-161J8LF | Bourns Inc. | RES ARRAY 8 RES 160 OHM 1506 | Dotaz |
|
CAY16-1803F4LF | Bourns Inc. | RES ARRAY 4 RES 180K OHM 1206 | Dotaz |
|
CAY16-1820F4LF | Bourns Inc. | RES ARRAY 4 RES 182 OHM 1206 | Dotaz |
|
CAY16-2700F4LF | Bourns Inc. | RES ARRAY 4 RES 270 OHM 1206 | Dotaz |
|
CAY16-330J4GLF | Bourns Inc. | RES ARRAY 4 RES 33 OHM 1206 | Dotaz |
|
CAY16-24R9F4LF | Bourns Inc. | RES ARRAY 4 RES 24.9 OHM 1206 | Dotaz |
|
CAY16-2672F4LF | Bourns Inc. | RES ARRAY 4 RES 26.7K OHM 1206 | Dotaz |
|
CAY16-220J8LF | Bourns Inc. | RES ARRAY 8 RES 22 OHM 1506 | Dotaz |
|
CAY16-121J8LF | Bourns Inc. | RES ARRAY 8 RES 120 OHM 1506 | Dotaz |
|
CAY16-4704F4LF | Bourns Inc. | RES ARRAY 4 RES 4.7M OHM 1206 | Dotaz |
|
CAY16-224J8LF | Bourns Inc. | RES ARRAY 8 RES 220K OHM 1506 | Dotaz |
|
CAY16-564J4LF | Bourns Inc. | RES ARRAY 4 RES 560K OHM 1206 | Dotaz |
|
CAY16-5492F4LF | Bourns Inc. | RES ARRAY 4 RES 54.9K OHM 1206 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers