Koupit BO2-09 s BYCHPS
Koupit se zárukou
BO2-09
- Part Number:
- BO2-09
- Výrobce:
- Bussmann (Eaton)
- Popis:
- FUSEHOLDER CAP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12304 Pieces
- Datový list:
- BO2-09.pdf
Úvod
BYCHIPS je distribuční odrůda pro BO2-09, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu BO2-09 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | - |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | BO2-09 |
| Pro použití s / příbuzné výrobky: | A2000 Series |
| Popis: | FUSEHOLDER CAP |
| Typ příslušenství: | Cap (Cover) |
| Email: | [email protected] |
Související díly pro BO2-09
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
6720005335 | Weidmuller | 3-UNIT BLOCK ESX10-T 34.5MM 1=10 | Dotaz |
 |
BO2-02TF | Eaton | FUSEHOLDER CAP | Dotaz |
|
BO2-10 | Eaton | FUSEHOLDER CAP | Dotaz |
|
BO2-03 | Eaton | FUSEHOLDER CAP | Dotaz |
|
BO2-04TF | Eaton | FUSEHOLDER CAP | Dotaz |
|
BO2-08 | Eaton | FUSEHOLDER CAP | Dotaz |
|
BO2-12 | Eaton | FUSEHOLDER CAP | Dotaz |
 |
0D0Z14RDZ | Littelfuse Inc. | GAUGE RING FOR 10A D01 FUSE RED | Dotaz |
|
BO2-05 | Eaton | FUSEHOLDER CAP | Dotaz |
|
BO2-02 | Eaton | FUSEHOLDER CAP | Dotaz |
|
BO2-14 | Eaton | FUSEHOLDER CAP | Dotaz |
|
BO2-03BF | Eaton | FUSEHOLDER CAP | Dotaz |
|
BO2-06 | Eaton | FUSEHOLDER CAP | Dotaz |
|
0SAO02.5Z | Littelfuse Inc. | ACS TYPE S FUSE ADAPTER 2.5A | Dotaz |
|
BO2-16 | Eaton | FUSEHOLDER CAP | Dotaz |
|
BO2-04 | Eaton | FUSEHOLDER CAP | Dotaz |
|
BO2-07 | Eaton | FUSEHOLDER CAP | Dotaz |
|
0SAO020.Z | Littelfuse Inc. | FUSE ADAPTER ACS TYPE S 20A | Dotaz |
|
160.7185.0002 | Littelfuse Inc. | SHUNT ATO CONNECTOR HARMONIC | Dotaz |
|
A3354710 | Eaton | FUSECLIPS CARTON 2" | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers