Koupit BFC280800004 s BYCHPS
Koupit se zárukou
BFC280800004
- Part Number:
- BFC280800004
- Výrobce:
- Angstrohm / Vishay
- Popis:
- CAP TRIM 1.4-5.5PF 250V THRUHOLE
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17258 Pieces
- Datový list:
- BFC280800004.pdf
Úvod
BYCHIPS je distribuční odrůda pro BFC280800004, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu BFC280800004 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 250V |
|---|---|
| Velikost / Rozměry: | Round - 0.299" Dia (7.60mm) |
| Série: | BFC2 808 |
| Obal: | Bulk |
| Ostatní jména: | 222280800004 |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 23 Weeks |
| Výrobní číslo výrobce: | BFC280800004 |
| Výška - Sedící (Max): | 0.394" (10.00mm) |
| Funkce: | General Purpose |
| Rozšířený popis: | 1.4 ~ 5.5pF Trimmer Capacitor 250V Top Adjustment Through Hole |
| Popis: | CAP TRIM 1.4-5.5PF 250V THRUHOLE |
| Rozsah kapacitního: | 1.4 ~ 5.5pF |
| Typ úpravy: | Top Adjustment |
| Email: | [email protected] |
Související díly pro BFC280800004
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
BFC280800006 | Vishay BC Components | CAP TRIMMER 2.5-22PF 250V TH | Dotaz |
 |
BFC280800005 | Vishay BC Components | CAP TRIM 2-10PF 250V THRU HOLE | Dotaz |
|
BFC280800016 | Vishay BC Components | CAP TRIM 2-18PF 250V THRU HOLE | Dotaz |
|
BFC280800018 | Vishay BC Components | CAP TRIM 2-9PF 250V THRU HOLE | Dotaz |
 |
BFC280832659 | Vishay BC Components | CAP TRIMMER 5.5-65PF 150V TH | Dotaz |
|
BFC280801001 | Vishay BC Components | CAP TRIM 5.5-65PF 150V THRU HOLE | Dotaz |
|
BFC280801006 | Vishay BC Components | CAP TRIM 5.5-50PF 150V THRU HOLE | Dotaz |
|
BFC280801029 | Vishay BC Components | CAP TRIM 5.5-50PF 150V THRU HOLE | Dotaz |
|
BFC280823209 | Vishay BC Components | CAP TRIM 4-20PF 150V THRU HOLE | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers