Koupit BFC237935334 s BYCHPS
Koupit se zárukou
BFC237935334
- Part Number:
- BFC237935334
- Výrobce:
- Angstrohm / Vishay
- Popis:
- CAP FILM 0.33UF 5% 160VDC RADIAL
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13054 Pieces
- Datový list:
- BFC237935334.pdf
Úvod
BYCHIPS je distribuční odrůda pro BFC237935334, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu BFC237935334 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napìtí - DC: | 160V |
|---|---|
| Napìtí - AC: | 100V |
| Tolerance: | ±5% |
| Ukončení: | PC Pins |
| Velikost / Rozměry: | 0.689" L x 0.236" W (17.50mm x 6.00mm) |
| Série: | MKP379 |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | Radial |
| Ostatní jména: | 222237935334 |
| Provozní teplota: | -55°C ~ 85°C |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 15 Weeks |
| Výrobní číslo výrobce: | BFC237935334 |
| Rozestup vývodù: | 0.591" (15.00mm) |
| Výška - Sedící (Max): | 0.472" (12.00mm) |
| Funkce: | Long Life |
| Rozšířený popis: | 0.33µF ±5% Film Capacitor 100V 160V Polypropylene (PP), Metallized Radial |
| ESR (Equivalent Resistance Series): | - |
| dielektrikum Materiál: | Polypropylene (PP), Metallized |
| Popis: | CAP FILM 0.33UF 5% 160VDC RADIAL |
| kapacitní: | 0.33µF |
| Aplikace: | High Pulse, DV/DT |
| Email: | [email protected] |
Související díly pro BFC237935334
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
BFC237935125 | Vishay BC Components | CAP FILM 1.2UF 5% 160VDC RADIAL | Dotaz |
|
BFC237935394 | Vishay BC Components | CAP FILM 0.39UF 5% 160VDC RADIAL | Dotaz |
|
BFC237935244 | Vishay BC Components | CAP FILM 0.24UF 5% 160VDC RADIAL | Dotaz |
|
BFC237935564 | Vishay BC Components | CAP FILM 0.56UF 5% 160VDC RADIAL | Dotaz |
|
BFC237935824 | Vishay BC Components | CAP FILM 0.82UF 5% 160VDC RADIAL | Dotaz |
|
BFC237935104 | Vishay BC Components | CAP FILM 0.1UF 5% 160VDC RADIAL | Dotaz |
|
BFC237935913 | Vishay BC Components | CAP FILM 0.091UF 5% 160VDC RAD | Dotaz |
|
BFC237935105 | Vishay BC Components | CAP FILM 1UF 5% 160VDC RADIAL | Dotaz |
|
BFC237935434 | Vishay BC Components | CAP FILM 0.43UF 5% 160VDC RADIAL | Dotaz |
|
BFC237935364 | Vishay BC Components | CAP FILM 0.36UF 5% 160VDC RADIAL | Dotaz |
|
BFC237935164 | Vishay BC Components | CAP FILM 0.16UF 5% 160VDC RADIAL | Dotaz |
|
BFC237935753 | Vishay BC Components | CAP FILM 0.075UF 5% 160VDC RAD | Dotaz |
|
BFC237935304 | Vishay BC Components | CAP FILM 0.3UF 5% 160VDC RADIAL | Dotaz |
|
BFC237935684 | Vishay BC Components | CAP FILM 0.68UF 5% 160VDC RADIAL | Dotaz |
|
BFC237935185 | Vishay BC Components | CAP FILM 1.8UF 5% 160VDC RADIAL | Dotaz |
|
BFC237935184 | Vishay BC Components | CAP FILM 0.18UF 5% 160VDC RADIAL | Dotaz |
|
BFC237935224 | Vishay BC Components | CAP FILM 0.22UF 5% 160VDC RADIAL | Dotaz |
|
BFC237935474 | Vishay BC Components | CAP FILM 0.47UF 5% 160VDC RADIAL | Dotaz |
|
BFC237935115 | Vishay BC Components | CAP FILM 1.1UF 5% 160VDC RADIAL | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers