Koupit B82791G2601N11 s BYCHPS
Koupit se zárukou
B82791G2601N11
- Part Number:
- B82791G2601N11
- Výrobce:
- EPCOS
- Popis:
- RING CORE DBL CHOKE 6.8MH 0.6A
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17991 Pieces
- Datový list:
- B82791G2601N11.pdf
Úvod
BYCHIPS je distribuční odrůda pro B82791G2601N11, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu B82791G2601N11 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | B82791 |
|---|---|
| Ostatní jména: | B82791G2601N011 |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | B82791G2601N11 |
| Rozšířený popis: | Line Common Mode Choke DCR |
| Popis: | RING CORE DBL CHOKE 6.8MH 0.6A |
| Email: | [email protected] |
Související díly pro B82791G2601N11
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
B82791H2701N1 | EPCOS (TDK) | CMC 4.7MH 700MA 2LN TH | Dotaz |
 |
B82791G15A16 | EPCOS (TDK) | CMC 4.7MH 100MA 2LN TH | Dotaz |
 |
B82791G2601N1 | EPCOS (TDK) | CMC 6.8MH 600MA 2LN TH | Dotaz |
|
B82791G2251N20 | EPCOS (TDK) | CMC 47MH 250MA 2LN TH | Dotaz |
|
B82791G2701N1 | EPCOS (TDK) | CMC 4.7MH 700MA 2LN TH | Dotaz |
|
B82791G2301N1 | EPCOS (TDK) | CMC 30MH 300MA 2LN TH | Dotaz |
|
B82791H2501N1 | EPCOS (TDK) | CMC 10MH 500MA 2LN TH | Dotaz |
|
B82791G2501N1 | EPCOS (TDK) | CMC 10MH 500MA 2LN TH | Dotaz |
|
B82791H2601N1 | EPCOS (TDK) | CMC 6.8MH 600MA 2LN TH | Dotaz |
 |
B82791G2251N020 | EPCOS (TDK) | CMC 47MH 250MA 2LN TH | Dotaz |
|
B82791G2351N1 | EPCOS (TDK) | CMC 22MH 350MA 2LN TH | Dotaz |
|
B82791G14A17 | EPCOS (TDK) | CMC 200UH 100MA 2LN TH | Dotaz |
|
B82791G2401N1 | EPCOS (TDK) | CMC 15MH 400MA 2LN TH | Dotaz |
|
B82791H2351N1 | EPCOS (TDK) | CMC 22MH 350MA 2LN TH | Dotaz |
|
B82791G12A14 | EPCOS (TDK) | DATA LINE-CHOKE 2X38MH 0.1A | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers