Koupit B39361X6966D100 s BYCHPS
Koupit se zárukou
B39361X6966D100
- Part Number:
- B39361X6966D100
- Výrobce:
- Epcos / RF360
- Popis:
- FILTER BANDPASS 36.125MHZ 5SIP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15934 Pieces
- Datový list:
- B39361X6966D100.pdf
Úvod
BYCHIPS je distribuční odrůda pro B39361X6966D100, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu B39361X6966D100 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Velikost / Rozměry: | 0.539" L x 0.189" W (13.70mm x 4.80mm) |
|---|---|
| Série: | - |
| hodnocení: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 5-SIP |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | B39361X6966D100 |
| Průchozí útlum: | 20.3dB |
| Výška (Max): | 0.094" (2.40mm) |
| Frekvence - Center: | 36.125MHz |
| Popis: | FILTER BANDPASS 36.125MHZ 5SIP |
| Bandwidth: | 8MHz |
| Aplikace: | Digital Cable Filter |
| Email: | [email protected] |
Související díly pro B39361X6966D100
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
B39361X6966M100 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW BANDPASS 36.125MHZ | Dotaz |
 |
B39361B5074Z810 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW RF 365.0MHZ SMD | Dotaz |
|
B39361B4843U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 360MHZ LOWLOSS SMD | Dotaz |
 |
B39361X6865N201 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW BANDPASS 36.125MHZ | Dotaz |
 |
B39361X6874D100 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER BANDPASS 36.125MHZ 5SIP | Dotaz |
|
B39361B7302A910 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 360MHZ LOWLOSS SMD | Dotaz |
|
B39361B3849U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 357.1MHZ LOWLOSS SMD | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers