Koupit ATC18012 s BYCHPS
Koupit se zárukou
ATC18012
- Part Number:
- ATC18012
- Výrobce:
- Panasonic
- Popis:
- BLACK FRONT PANEL
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 19871 Pieces
- Datový list:
- ATC18012.pdf
Úvod
BYCHIPS je distribuční odrůda pro ATC18012, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu ATC18012 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 8 Weeks |
| Výrobní číslo výrobce: | ATC18012 |
| Rozšířený popis: | |
| Popis: | BLACK FRONT PANEL |
| Email: | [email protected] |
Související díly pro ATC18012
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
ATC18011C8 | Panasonic Industrial Automation Sales | PANEL COVER GY | Dotaz |
|
ATC18013 | Panasonic Industrial Automation Sales | FRONT PANEL COVER BK | Dotaz |
|
ATC18012C9 | Panasonic Industrial Automation Sales | PANEL COVER GY | Dotaz |
|
ATC18016C10 | Panasonic Industrial Automation Sales | PANEL COVER GRAY | Dotaz |
|
ATC18011 | Panasonic Industrial Automation Sales | FRONT PANEL COVER, BLACK FOR PM4 | Dotaz |
|
ATC18015 | Panasonic Industrial Automation Sales | FRONT PANEL COVER BK | Dotaz |
|
ATC18016C7 | Panasonic Industrial Automation Sales | PANEL COVER BK | Dotaz |
|
ATC18014 | Panasonic Industrial Automation Sales | FRONT PANEL COVER BK | Dotaz |
|
ATC18011C5 | Panasonic Industrial Automation Sales | PANEL COVER BK | Dotaz |
|
ATC18012C6 | Panasonic Industrial Automation Sales | PANEL COVER BK | Dotaz |
|
ATC18016 | Panasonic Industrial Automation Sales | FRONT PANEL COVER BK | Dotaz |
 |
ATC18002 | Panasonic Industrial Automation Sales | RUBBER GASKET (50MM) FOR MULT | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers