Koupit APTSM120AM09CD3AG s BYCHPS
Koupit se zárukou
APTSM120AM09CD3AG
- Part Number:
- APTSM120AM09CD3AG
- Výrobce:
- Microsemi
- Popis:
- POWER MODULE - SIC
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18000 Pieces
- Datový list:
- APTSM120AM09CD3AG.pdf
Úvod
BYCHIPS je distribuční odrůda pro APTSM120AM09CD3AG, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu APTSM120AM09CD3AG e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 22 Weeks |
| Výrobní číslo výrobce: | APTSM120AM09CD3AG |
| Rozšířený popis: | Mosfet Array |
| Popis: | POWER MODULE - SIC |
| Email: | [email protected] |
Související díly pro APTSM120AM09CD3AG
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
APTSM120AM08CT6AG | Microsemi Corporation | POWER MODULE - SIC | Dotaz |
|
APTSM120AM25CT3AG | Microsemi Corporation | POWER MODULE - SIC | Dotaz |
|
APTSM120TAM33CTPAG | Microsemi Corporation | POWER MODULE - SIC | Dotaz |
|
APTSM120AM55CT1AG | Microsemi Corporation | POWER MODULE - SIC | Dotaz |
|
APTSM120AM14CD3AG | Microsemi Corporation | POWER MODULE - SIC | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers