Koupit ACCESSORIES-PLASTIC COVER 2.1 s BYCHPS
Koupit se zárukou
ACCESSORIES-PLASTIC COVER 2.1
- Part Number:
- ACCESSORIES-PLASTIC COVER 2.1
- Výrobce:
- Schaffner EMC, Inc.
- Popis:
- COVER TERM PLAS FN3359 150/180A
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12055 Pieces
- Datový list:
- ACCESSORIES-PLASTIC COVER 2.1.pdf
Úvod
BYCHIPS je distribuční odrůda pro ACCESSORIES-PLASTIC COVER 2.1, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu ACCESSORIES-PLASTIC COVER 2.1 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | - |
|---|---|
| Ostatní jména: | 1151-050 801917 817-1768 ACCESSORIES-PLASTIC COVER 2.1-ND ACCESSORIES-PLASTICCOVER2.1 ACCESSORIES-PLASTICCOVER2.1-ND ACCESSORIESPLASTICCOVER21 |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 10 Weeks |
| Výrobní číslo výrobce: | ACCESSORIES-PLASTIC COVER 2.1 |
| Pro použití s / příbuzné výrobky: | FN3359 Series |
| Popis: | COVER TERM PLAS FN3359 150/180A |
| Typ příslušenství: | Cover |
| Email: | [email protected] |
Související díly pro ACCESSORIES-PLASTIC COVER 2.1
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
ACCESSORIES-PLASTIC COVER 2.5 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 800/1000A | Dotaz |
 |
ACCESSORIES-PLASTIC COVER 2.3 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 320/400A | Dotaz |
 |
ACCESSORIES-PLASTIC COVER 2.4 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 600A | Dotaz |
 |
ACCESSORIES-PLASTIC COVER 1.3 | Schaffner EMC Inc. | COVER TERM PLAS FN3270 800/1000A | Dotaz |
 |
ACCESSORIES-PLASTIC COVER 1.1 | Schaffner EMC Inc. | COVER TERM PLAS FN3270 150-600A | Dotaz |
 |
ACCESSORIES-PLASTIC COVER 2.2 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 250A | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog