Koupit 7940005581 s BYCHPS
Koupit se zárukou
7940005581
- Part Number:
- 7940005581
- Výrobce:
- Weidmuller
- Popis:
- ECO 30 24VAC/DC/240V 8A FORM A
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12979 Pieces
- Datový list:
- 7940005581.pdf
Úvod
BYCHIPS je distribuční odrůda pro 7940005581, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 7940005581 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | - |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 6 Weeks |
| Výrobní číslo výrobce: | 7940005581 |
| Rozšířený popis: | Relay Coil |
| Popis: | ECO 30 24VAC/DC/240V 8A FORM A |
| Email: | [email protected] |
Související díly pro 7940005581
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
2901913 | Phoenix Contact | RELAY GEN PURPOSE SPST 10A 230V | Dotaz |
 |
7940008171 | Weidmuller | RELAY GEN PURPOSE 4PDT 6A 24V | Dotaz |
 |
7940007742 | Weidmuller | RELAY GEN PURPOSE 3PDT 10A 220V | Dotaz |
 |
V23101D1106B301 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 3A 12V | Dotaz |
 |
7940007637 | Weidmuller | RELAY GEN PURPOSE 4PDT 6A 230V | Dotaz |
 |
7940007732 | Weidmuller | RELAY GEN PURPOSE 3PDT 10A 24V | Dotaz |
|
7-1415356-1 | TE Connectivity Potter & Brumfield Relays | PBH14009 | Dotaz |
 |
7940007723 | Weidmuller | RS-70 AUTOMOTIVE RELAY BASE | Dotaz |
|
7940011169 | Weidmuller | AMS 400A/4/20MA/CC/110VAC | Dotaz |
 |
G6CU-2117P-US-DC5 | Omron Electronics Inc-EMC Div | RELAY GENERAL PURPOSE DPST 8A 5V | Dotaz |
 |
G7L-2A-BUB DC6 | Omron Electronics Inc-EMC Div | RELAY GEN PURPOSE DPST 25A 6V | Dotaz |
|
7940000063 | Weidmuller | MCZ 50 SOLENOID DRIVER | Dotaz |
 |
8690550000 | Weidmuller | RELAY GEN PURPOSE 3PDT 10A 115V | Dotaz |
|
7940034328 | Weidmuller | RELAY OPTICAL 72VDC 1N/O | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers