Koupit 450LSU3300M77X86 s BYCHPS
Koupit se zárukou
450LSU3300M77X86
- Part Number:
- 450LSU3300M77X86
- Výrobce:
- Rubycon
- Popis:
- SCREW TERMINAL
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13634 Pieces
- Datový list:
- 1.450LSU3300M77X86.pdf2.450LSU3300M77X86.pdf
Úvod
BYCHIPS je distribuční odrůda pro 450LSU3300M77X86, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 450LSU3300M77X86 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 16 Weeks |
| Výrobní číslo výrobce: | 450LSU3300M77X86 |
| Rozšířený popis: | Aluminum Capacitors |
| Popis: | SCREW TERMINAL |
| Email: | [email protected] |
Související díly pro 450LSU3300M77X86
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
450LSU2200M64X119 | Rubycon | SCREW TERMINAL | Dotaz |
|
450LSU10000M90X161 | Rubycon | SCREW TERMINAL | Dotaz |
|
450LSU4700M64X189 | Rubycon | SCREW TERMINAL | Dotaz |
|
450LSU6800M77X144 | Rubycon | SCREW TERMINAL | Dotaz |
|
450LSU3300M64X149 | Rubycon | SCREW TERMINAL | Dotaz |
 |
450LSU6800MNB77X191 | Rubycon | CAP ALUM 6800UF 20% 450V SCREW | Dotaz |
|
450LSU15000M90X236 | Rubycon | SCREW TERMINAL | Dotaz |
|
450LSU4700MEFC77X141 | Rubycon | CAP ALUM 4700UF 20% 450V SCREW | Dotaz |
|
450LSU10000M90X221 | Rubycon | SCREW TERMINAL | Dotaz |
|
450LSU6800M90X141 | Rubycon | SCREW TERMINAL | Dotaz |
|
450LSU1500M51X106 | Rubycon | SCREW TERMINAL | Dotaz |
 |
450LSU4700MNB77X141 | Rubycon | CAP ALUM 4700UF 20% 450V SCREW | Dotaz |
|
450LSU18000M90X241 | Rubycon | SCREW TERMINAL | Dotaz |
 |
450LSU5600MNB77X151 | Rubycon | CAP ALUM 5600UF 20% 450V SCREW | Dotaz |
 |
450LSU1500MNB51X118 | Rubycon | CAP ALUM 1500UF 20% 450V SCREW | Dotaz |
|
450LSU6800M77X155 | Rubycon | SCREW TERMINAL | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers