Koupit 4416P-1-822LF s BYCHPS
Koupit se zárukou
4416P-1-822LF
- Part Number:
- 4416P-1-822LF
- Výrobce:
- Bourns, Inc.
- Popis:
- RES ARRAY 8 RES 8.2K OHM 16SOIC
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15184 Pieces
- Datový list:
- 4416P-1-822LF.pdf
Úvod
BYCHIPS je distribuční odrůda pro 4416P-1-822LF, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 4416P-1-822LF e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Tolerance: | ±2% |
|---|---|
| teplotní koeficient: | ±100ppm/°C |
| Dodavatel zařízení Package: | 16-SOL |
| Velikost / Rozměry: | 0.410" L x 0.295" W (10.41mm x 7.50mm) |
| Série: | 4400P |
| Odpor (Ohm): | 8.2k |
| Power Per Element: | 160mW |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 16-SOIC (0.295", 7.50mm Width) |
| Provozní teplota: | -55°C ~ 125°C |
| Počet rezistory: | 8 |
| Počet Pins: | 16 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 8 Weeks |
| Výrobní číslo výrobce: | 4416P-1-822LF |
| Výška - Sedící (Max): | 0.114" (2.90mm) |
| Rozšířený popis: | 8.2k Ohm ±2% 160mW Power Per Element Isolated Resistor Network/Array ±100ppm/°C 16-SOIC (0.295", 7.50mm Width) |
| Popis: | RES ARRAY 8 RES 8.2K OHM 16SOIC |
| Typ obvodu: | Isolated |
| Aplikace: | - |
| Email: | [email protected] |
Související díly pro 4416P-1-822LF
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
4416P-T01-331LF | Bourns Inc. | RES ARRAY 8 RES 330 OHM 16SOIC | Dotaz |
 |
4416P-T03-221/331 | Bourns Inc. | RES NTWRK 28 RES MULT OHM 16SOIC | Dotaz |
|
4416P-2-223 | Bourns Inc. | RES ARRAY 15 RES 22K OHM 16SOIC | Dotaz |
|
4416P-1-470LF | Bourns Inc. | RES ARRAY 8 RES 47 OHM 16SOIC | Dotaz |
|
4416P-1-151 | Bourns Inc. | RES ARRAY 8 RES 150 OHM 16SOIC | Dotaz |
|
4416P-T02-274 | Bourns Inc. | RES ARRAY 15 RES 270K OHM 16SOIC | Dotaz |
|
4416P-2-472LF | Bourns Inc. | RES ARRAY 15 RES 4.7K OHM 16SOIC | Dotaz |
|
4416P-1-390 | Bourns Inc. | RES ARRAY 8 RES 39 OHM 16SOIC | Dotaz |
|
4416P-1-331LF | Bourns Inc. | RES ARRAY 8 RES 330 OHM 16SOIC | Dotaz |
|
4416P-T02-102LF | Bourns Inc. | RES ARRAY 15 RES 1K OHM 16SOIC | Dotaz |
|
4416P-1-472LF | Bourns Inc. | RES ARRAY 8 RES 4.7K OHM 16SOIC | Dotaz |
|
4416P-T01-102 | Bourns Inc. | RES ARRAY 8 RES 1K OHM 16SOIC | Dotaz |
|
4416P-1-221LF | Bourns Inc. | RES ARRAY 8 RES 220 OHM 16SOIC | Dotaz |
|
4416P-T01-105 | Bourns Inc. | RES ARRAY 8 RES 1M OHM 16SOIC | Dotaz |
|
4416P-T01-510 | Bourns Inc. | RES ARRAY 8 RES 51 OHM 16SOIC | Dotaz |
|
4416P-T02-104 | Bourns Inc. | RES ARRAY 15 RES 100K OHM 16SOIC | Dotaz |
|
4416P-1-105 | Bourns Inc. | RES ARRAY 8 RES 1M OHM 16SOIC | Dotaz |
|
4416P-1-104 | Bourns Inc. | RES ARRAY 8 RES 100K OHM 16SOIC | Dotaz |
|
4416P-2-562 | Bourns Inc. | RES ARRAY 15 RES 5.6K OHM 16SOIC | Dotaz |
|
4416P-T01-151 | Bourns Inc. | RES ARRAY 8 RES 150 OHM 16SOIC | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers