Koupit 4308H-102-103 s BYCHPS
Koupit se zárukou
4308H-102-103
- Part Number:
- 4308H-102-103
- Výrobce:
- Bourns, Inc.
- Popis:
- RES ARRAY 4 RES 10K OHM 8SIP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12348 Pieces
- Datový list:
- 4308H-102-103.pdf
Úvod
BYCHIPS je distribuční odrůda pro 4308H-102-103, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 4308H-102-103 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Tolerance: | ±2% |
|---|---|
| teplotní koeficient: | ±100ppm/°C |
| Dodavatel zařízení Package: | 8-SIP |
| Velikost / Rozměry: | 0.784" L x 0.085" W (19.91mm x 2.16mm) |
| Série: | 4300H |
| Odpor (Ohm): | 10k |
| Power Per Element: | 500mW |
| Obal: | Tube |
| Paket / krabice: | 8-SIP |
| Provozní teplota: | -55°C ~ 125°C |
| Počet rezistory: | 4 |
| Počet Pins: | 8 |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 16 Weeks |
| Výrobní číslo výrobce: | 4308H-102-103 |
| Výška - Sedící (Max): | 0.350" (8.89mm) |
| Rozšířený popis: | 10k Ohm ±2% 500mW Power Per Element Isolated Resistor Network/Array ±100ppm/°C 8-SIP |
| Popis: | RES ARRAY 4 RES 10K OHM 8SIP |
| Typ obvodu: | Isolated |
| Aplikace: | - |
| Email: | [email protected] |
Související díly pro 4308H-102-103
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
4308H-102-331 | Bourns Inc. | RES ARRAY 4 RES 330 OHM 8SIP | Dotaz |
 |
4308H-102-330 | Bourns Inc. | RES ARRAY 4 RES 33 OHM 8SIP | Dotaz |
|
4308H-102-823 | Bourns Inc. | RES ARRAY 4 RES 82K OHM 8SIP | Dotaz |
|
4308H-102-202 | Bourns Inc. | RES ARRAY 4 RES 2K OHM 8SIP | Dotaz |
|
4308H-101-153 | Bourns Inc. | RES ARRAY 7 RES 15K OHM 8SIP | Dotaz |
|
4308H-102-220 | Bourns Inc. | RES ARRAY 4 RES 22 OHM 8SIP | Dotaz |
|
4308H-101-102LF | Bourns Inc. | RES ARRAY 7 RES 1K OHM 8SIP | Dotaz |
|
4308H-101-561LF | Bourns Inc. | RES ARRAY 7 RES 560 OHM 8SIP | Dotaz |
|
4308H-101-331 | Bourns Inc. | RES ARRAY 7 RES 330 OHM 8SIP | Dotaz |
|
4308H-101-392 | Bourns Inc. | RES ARRAY 7 RES 3.9K OHM 8SIP | Dotaz |
|
4308H-101-562LF | Bourns Inc. | RES ARRAY 7 RES 5.6K OHM 8SIP | Dotaz |
|
4308H-101-243 | Bourns Inc. | RES ARRAY 7 RES 24K OHM 8SIP | Dotaz |
|
4308H-102-511LF | Bourns Inc. | RES ARRAY 4 RES 510 OHM 8SIP | Dotaz |
|
4308H-102-680 | Bourns Inc. | RES ARRAY 4 RES 68 OHM 8SIP | Dotaz |
|
4308H-101-102 | Bourns Inc. | RES ARRAY 7 RES 1K OHM 8SIP | Dotaz |
|
4308H-101-472 | Bourns Inc. | RES ARRAY 7 RES 4.7K OHM 8SIP | Dotaz |
|
4308H-102-470 | Bourns Inc. | RES ARRAY 4 RES 47 OHM 8SIP | Dotaz |
|
4308H-102-471LF | Bourns Inc. | RES ARRAY 4 RES 470 OHM 8SIP | Dotaz |
|
4308H-101-222 | Bourns Inc. | RES ARRAY 7 RES 2.2K OHM 8SIP | Dotaz |
|
4308H-102-471 | Bourns Inc. | RES ARRAY 4 RES 470 OHM 8SIP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers