Koupit 420USH270MEFC22X40 s BYCHPS
Koupit se zárukou
420USH270MEFC22X40
- Part Number:
- 420USH270MEFC22X40
- Výrobce:
- Rubycon
- Popis:
- SNAP TERMINAL
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 14490 Pieces
- Datový list:
- 1.420USH270MEFC22X40.pdf2.420USH270MEFC22X40.pdf
Úvod
BYCHIPS je distribuční odrůda pro 420USH270MEFC22X40, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 420USH270MEFC22X40 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 16 Weeks |
| Výrobní číslo výrobce: | 420USH270MEFC22X40 |
| Rozšířený popis: | Aluminum Capacitors |
| Popis: | SNAP TERMINAL |
| Email: | [email protected] |
Související díly pro 420USH270MEFC22X40
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
420USH220MEFC25X25 | Rubycon | SNAP TERMINAL | Dotaz |
|
420USH220MEFC22X35 | Rubycon | CAP ALUM 220UF 20% 420V SNAP | Dotaz |
|
420USH270MEFC25X30 | Rubycon | SNAP TERMINAL | Dotaz |
 |
SLPX222M160H7P3 | Cornell Dubilier Electronics (CDE) | CAP ALUM 2200UF 20% 160V SNAP | Dotaz |
 |
UVK1H010MDD1TA | Nichicon | CAP ALUM 1UF 20% 50V RADIAL | Dotaz |
 |
MAL229967102E3 | Vishay BC Components | CAP ALUM 1000UF 20% 450V SNAP 4L | Dotaz |
 |
B43501B3107M80 | EPCOS (TDK) | CAP ALUM 100UF 20% 385V SNAP | Dotaz |
|
420USH390MEFC22X50 | Rubycon | SNAP TERMINAL | Dotaz |
|
B43601B2128M82 | EPCOS (TDK) | CAP ALUM 1200UF 20% 200V SNAP | Dotaz |
 |
450MXH330MEFCSN35X30 | Rubycon | CAP ALUM 330UF 20% 450V SNAP | Dotaz |
|
420USH820MEFC35X45 | Rubycon | CAP ALUM 820UF 20% 420V SNAP | Dotaz |
|
420USH390MEFC30X30 | Rubycon | CAP ALUM 390UF 20% 420V SNAP | Dotaz |
|
420USH1000MEFC35X50 | Rubycon | CAP ALUM 1000UF 20% 420V SNAP | Dotaz |
|
35SEV100M6.3X8 | Rubycon | SMD CAP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog