Koupit 400LSG4700M77X115 s BYCHPS
Koupit se zárukou
400LSG4700M77X115
- Part Number:
- 400LSG4700M77X115
- Výrobce:
- Rubycon
- Popis:
- SCREW TERMINAL
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12283 Pieces
- Datový list:
- 1.400LSG4700M77X115.pdf2.400LSG4700M77X115.pdf
Úvod
BYCHIPS je distribuční odrůda pro 400LSG4700M77X115, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 400LSG4700M77X115 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 16 Weeks |
| Výrobní číslo výrobce: | 400LSG4700M77X115 |
| Rozšířený popis: | Aluminum Capacitors |
| Popis: | SCREW TERMINAL |
| Email: | [email protected] |
Související díly pro 400LSG4700M77X115
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
400LSG4700MEFC77X121 | Rubycon | CAP ALUM 4700UF 20% 400V SCREW | Dotaz |
 |
400LSG15000MEFC90X234 | Rubycon | CAP ALUM 15000UF 20% 400V SCREW | Dotaz |
 |
400LSG14000M90X195 | Rubycon | SCREW TERMINAL | Dotaz |
|
400LSG4700MNB77X121 | Rubycon | CAP ALUM 4700UF 20% 400V SCREW | Dotaz |
|
400LSG2200MEFC51X138 | Rubycon | SCREW TERMINAL | Dotaz |
|
400LSG6800M77X171 | Rubycon | SCREW TERMINAL | Dotaz |
|
400LSG5600M77X141 | Rubycon | SCREW TERMINAL | Dotaz |
|
400LSG10000MEFC90X191 | Rubycon | CAP ALUM 10000UF 20% 400V SCREW | Dotaz |
|
400LSG3900MDC464X114 | Rubycon | SCREW TERMINAL | Dotaz |
 |
400LSG3300MNB64X139 | Rubycon | CAP ALUM 3300UF 20% 400V SCREW | Dotaz |
|
400LSG3300MDC464X99 | Rubycon | SCREW TERMINAL | Dotaz |
 |
400LSG2200MNB51X138 | Rubycon | CAP ALUM 2200UF 20% 400V SCREW | Dotaz |
|
400LSG5600MEFC77X141 | Rubycon | CAP ALUM 5600UF 20% 400V SCREW | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers