Koupit 35MXG8200MEFCSN30X25 s BYCHPS
Koupit se zárukou
35MXG8200MEFCSN30X25
- Part Number:
- 35MXG8200MEFCSN30X25
- Výrobce:
- Rubycon
- Popis:
- CAP ALUM 8200UF 20% 35V SNAP-IN
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12641 Pieces
Úvod
BYCHIPS je distribuční odrůda pro 35MXG8200MEFCSN30X25, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 35MXG8200MEFCSN30X25 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| napìtí: | 35V |
|---|---|
| Tolerance: | ±20% |
| Povrchová montáž Land Velikost: | - |
| Velikost / Rozměry: | 1.181" Dia (30.00mm) |
| Série: | MXG |
| Ripple Current: | 2.85A @ 120Hz |
| Polarizace: | Polar |
| Obal: | Bulk |
| Paket / krabice: | Radial, Can - Snap-In |
| Ostatní jména: | 1189-3909 |
| Provozní teplota: | -40°C ~ 105°C |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 16 Weeks |
| Výrobní číslo výrobce: | 35MXG8200MEFCSN30X25 |
| Životnost @ Temp.: | 3000 Hrs @ 105°C |
| Rozestup vývodù: | 0.394" (10.00mm) |
| Impedance: | - |
| Výška - Sedící (Max): | 1.063" (27.00mm) |
| Rozšířený popis: | 8200µF 35V Aluminum Capacitors Radial, Can - Snap-In 3000 Hrs @ 105°C |
| ESR (Equivalent Resistance Series): | - |
| Popis: | CAP ALUM 8200UF 20% 35V SNAP-IN |
| kapacitní: | 8200µF |
| Aplikace: | General Purpose |
| Email: | [email protected] |
Související díly pro 35MXG8200MEFCSN30X25
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
35MXG6800MEFCSN22X40 | Rubycon | CAP ALUM 6800UF 20% 35V SNAP | Dotaz |
 |
35MXG3900MEFC22X25 | Rubycon | CAP ALUM 3900UF 20% 35V SNAP | Dotaz |
 |
35MXG8200MEFCSN22X45 | Rubycon | CAP ALUM 8200UF 20% 35V SNAP-IN | Dotaz |
|
35MXG4700MEFC22X30 | Rubycon | CAP ALUM 4700UF 20% 35V SNAP | Dotaz |
|
35MXG5600MEFC25X25 | Rubycon | CAP ALUM 5600UF 20% 35V SNAP | Dotaz |
|
35MXG6800MEFC22X40 | Rubycon | CAP ALUM 6800UF 20% 35V SNAP | Dotaz |
|
35MXG15000MEFC35X35 | Rubycon | CAP ALUM 15000UF 20% 35V SNAP | Dotaz |
 |
35MXG4700MEFCSN25X25 | Rubycon | CAP ALUM 4700UF 20% 35V SNAP | Dotaz |
|
35MXG15000MEFC25X50 | Rubycon | CAP ALUM 15000UF 20% 35V SNAP | Dotaz |
|
35MXG6800MEFC25X30 | Rubycon | CAP ALUM 6800UF 20% 35V SNAP | Dotaz |
|
35MXG22000MEFC35X40 | Rubycon | CAP ALUM 22000UF 20% 35V SNAP | Dotaz |
|
35MXG5600MEFC20X40 | Rubycon | CAP ALUM 5600UF 20% 35V SNAP | Dotaz |
 |
35MXG27000MEFCSN35X50 | Rubycon | CAP ALUM 27000UF 20% 35V SNAP | Dotaz |
|
35MXG10000MEFCSN30X30 | Rubycon | CAP ALUM 10000UF 20% 35V SNAP-IN | Dotaz |
|
35MXG12000MEFC30X35 | Rubycon | SNAP TERMINAL | Dotaz |
|
35MXG15000MEFC30X40 | Rubycon | CAP ALUM 15000UF 20% 35V SNAP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers