Koupit 2A1667-14 s BYCHPS
Koupit se zárukou
2A1667-14
- Part Number:
- 2A1667-14
- Výrobce:
- Bussmann (Eaton)
- Popis:
- DOOR FLUSH 33
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18117 Pieces
- Datový list:
- 2A1667-14.pdf
Úvod
BYCHIPS je distribuční odrůda pro 2A1667-14, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 2A1667-14 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 3 Weeks |
| Výrobní číslo výrobce: | 2A1667-14 |
| Popis: | DOOR FLUSH 33 |
| Email: | [email protected] |
Související díly pro 2A1667-14
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
2A1667-3 | Eaton | DOOR FLUSH 50 | Dotaz |
|
2A1667-24 | Eaton | ASSEMBLY WITH LOUVERS 59IN FLUSH | Dotaz |
|
2A1667-11 | Eaton | DOOR IN DOOR 69 | Dotaz |
|
2A1667-8 | Eaton | DOOR IN DOOR FLUSH 59 | Dotaz |
|
2A1667-7 | Eaton | DOOR IN DOOR FLUSH 50 | Dotaz |
|
2A1667-19 | Eaton | ASSEMBLY WITH LOUVERS 50IN DOOR | Dotaz |
|
2A1667-17 | Eaton | ASSEMBLY WITH LOUVERS 50IN DOOR | Dotaz |
|
2A1667-13 | Eaton | DOOR 33 | Dotaz |
|
2A1667-20 | Eaton | ASSEMBLY WITH LOUVERS 50IN FLLUS | Dotaz |
|
2A1667-18 | Eaton | ASSEMBLY WITH LOUVERS 50IN FLUSH | Dotaz |
|
2A1667-6 | Eaton | DOOR IN DOOR 59 | Dotaz |
|
2A1667-22 | Eaton | ASSEMBLY WITH LOUVERS 59IN FLUSH | Dotaz |
|
2A1667-2 | Eaton | DOOR 59 | Dotaz |
|
2A1667-4 | Eaton | DOOR FLUSH 59 | Dotaz |
|
2A1667-16 | Eaton | DOOR IN DOOR FLUSH 33 | Dotaz |
|
2A1667-10 | Eaton | DOOR FLUSH 69 | Dotaz |
|
2A1667-15 | Eaton | DOOR IN DOOR 33 | Dotaz |
|
2A1667-23 | Eaton | ASSEMBLY WITH LOUVERS 59IN DOOR | Dotaz |
|
2A1667-12 | Eaton | DOOR IN DOOR FLUSH 69 | Dotaz |
|
2A1667-5 | Eaton | DOOR IN DOOR 50 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers