Koupit 250TXW47MEFR10X25 s BYCHPS
Koupit se zárukou
250TXW47MEFR10X25
- Part Number:
- 250TXW47MEFR10X25
- Výrobce:
- Rubycon
- Popis:
- CAP ALUM
- dostupné množství:
- 14916 Pieces
- Datový list:
- 1.250TXW47MEFR10X25.pdf2.250TXW47MEFR10X25.pdf
Úvod
BYCHIPS je distribuční odrůda pro 250TXW47MEFR10X25, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 250TXW47MEFR10X25 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Výrobní standardní doba výroby: | 16 Weeks |
| Výrobní číslo výrobce: | 250TXW47MEFR10X25 |
| Rozšířený popis: | Aluminum Capacitors |
| Popis: | CAP ALUM |
| Email: | [email protected] |
Související díly pro 250TXW47MEFR10X25
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
250TXW120MEFC16X25 | Rubycon | CAP ALUM 120UF 20% 250V RADIAL | Dotaz |
 |
250TXW470MEFC18X50 | Rubycon | CAP ALUM 470UF 20% 250V RADIAL | Dotaz |
 |
250TXW180MEFC16X30 | Rubycon | CAP ALUM 180UF 20% 250V RADIAL | Dotaz |
 |
250TXW100MEFC12.5X30 | Rubycon | CAP ALUM 100UF 20% 250V RADIAL | Dotaz |
 |
250TXW150MEFR12.5X40 | Rubycon | CAP ALUM | Dotaz |
|
250TXW47MEFC8X35 | Rubycon | CAP ALUM | Dotaz |
|
250TXW330MEFC18X40 | Rubycon | CAP ALUM 330UF 20% 250V RADIAL | Dotaz |
|
250TXW270MEFR18X35 | Rubycon | CAP ALUM | Dotaz |
|
250TXW220MEFC12.5X55 | Rubycon | CAP ALUM | Dotaz |
 |
250TXW220MEFC18X30 | Rubycon | CAP ALUM 220UF 20% 250V RADIAL | Dotaz |
|
250TXW68MEFCWN10X35 | Rubycon | CAP ALUM 68UF 20% 250V RADIAL | Dotaz |
 |
250TXW180MCC16X30 | Rubycon | CAP ALUM 180UF 20% 250V RADIAL | Dotaz |
|
250TXW82MEFR12.5X25 | Rubycon | CAP ALUM | Dotaz |
 |
250TXW180M18X25 | Rubycon | CAP ALUM 180UF 20% 250V RADIAL | Dotaz |
|
250TXW100MEFR10X45 | Rubycon | CAP ALUM | Dotaz |
|
250TXW82MEFR10X40 | Rubycon | CAP ALUM | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers