Koupit 1812Y6300101KAR s BYCHPS
Koupit se zárukou
1812Y6300101KAR
- Part Number:
- 1812Y6300101KAR
- Výrobce:
- Knowles / Syfer
- Popis:
- CAP CER 1812
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16488 Pieces
- Datový list:
- 1812Y6300101KAR.pdf
Úvod
BYCHIPS je distribuční odrůda pro 1812Y6300101KAR, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 1812Y6300101KAR e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 9 Weeks |
| Výrobní číslo výrobce: | 1812Y6300101KAR |
| Rozšířený popis: | Ceramic Capacitor |
| Popis: | CAP CER 1812 |
| Email: | [email protected] |
Související díly pro 1812Y6300101KAR
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
1812Y6300101JAT | Knowles Syfer | CAP CER 1812 | Dotaz |
|
1812Y6300101JCT | Knowles Syfer | CAP CER 1812 | Dotaz |
|
1812Y6300101FCR | Knowles Syfer | CAP CER 1812 | Dotaz |
|
1812Y6300101KAT | Knowles Syfer | CAP CER 1812 | Dotaz |
|
1812Y6300101GCR | Knowles Syfer | CAP CER 1812 | Dotaz |
|
1812Y6300101GAR | Knowles Syfer | CAP CER 1812 | Dotaz |
|
1812Y6300101JCR | Knowles Syfer | CAP CER 1812 | Dotaz |
|
1812Y6300101FAT | Knowles Syfer | CAP CER 1812 | Dotaz |
|
1812Y6300104MER | Knowles Syfer | CAP CER 1812 | Dotaz |
|
1812Y6300103KXR | Knowles Syfer | CAP CER 1812 | Dotaz |
|
1812Y6300102FCT | Knowles Syfer | CAP CER 1812 | Dotaz |
|
1812Y6300101JAR | Knowles Syfer | CAP CER 1812 | Dotaz |
|
1812Y6300101KCT | Knowles Syfer | CAP CER 1812 | Dotaz |
|
1812Y6300101FAR | Knowles Syfer | CAP CER 1812 | Dotaz |
|
1812Y6300101GAT | Knowles Syfer | CAP CER 1812 | Dotaz |
|
1812Y6300101GCT | Knowles Syfer | CAP CER 1812 | Dotaz |
|
1812Y6300101FCT | Knowles Syfer | CAP CER 1812 | Dotaz |
|
1812Y6300101KCR | Knowles Syfer | CAP CER 1812 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers