Koupit 170M1757 s BYCHPS
Koupit se zárukou
170M1757
- Part Number:
- 170M1757
- Výrobce:
- Bussmann (Eaton)
- Popis:
- FUSE 125A 690V 000FU/70 AR CU
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15088 Pieces
- Datový list:
- 170M1757.pdf
Úvod
BYCHIPS je distribuční odrůda pro 170M1757, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 170M1757 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Velikost / Rozměry: | 2.126" L x 1.429" W x 0.945" H (54.00mm x 36.30mm x 24.00mm) |
|---|---|
| Série: | * |
| Obal: | Bulk |
| Paket / krabice: | Rectangular, Blade |
| Typ montáže: | Bolt Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 9 Weeks |
| Výrobní číslo výrobce: | 170M1757 |
| Typ pojistky: | Square |
| Popis: | FUSE 125A 690V 000FU/70 AR CU |
| Email: | [email protected] |
Související díly pro 170M1757
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
170M1758 | Eaton | FUSE 160A 690V 000FU/70 AR CU | Dotaz |
|
170M1759 | Eaton | FUSE 200A 690V 000FU/70 AR CU | Dotaz |
|
170M1755 | Eaton | FUSE 80A 690V IEC AR 000FU/70 | Dotaz |
|
170M1756 | Eaton | FUSE 100A 690V 000FU/70 AR CU | Dotaz |
|
170M1753 | Eaton | FUSE 50A 690V 000FU/70 AR CU | Dotaz |
|
170M1754 | Eaton | FUSE 63A 690V 000FU/70 AR CU | Dotaz |
|
170M1762 | Eaton | FUSE 350A 690V 000FU/70 AR CU | Dotaz |
|
170M1751 | Eaton | FUSE 32A 690V 000FU/70 AR CU | Dotaz |
|
170M1752 | Eaton | FUSE 40A 690V 000FU/70 AR CU | Dotaz |
|
170M1750 | Eaton | FUSE 25A 690V 000FU/70 AR CU | Dotaz |
|
170M1761 | Eaton | FUSE 315A 690V IEC AR 000FU/70 | Dotaz |
|
170M1760 | Eaton | FUSE 250A 690V 000FU/70 AR CU | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers