Koupit 160TXW82MEFR8X35 s BYCHPS
Koupit se zárukou
160TXW82MEFR8X35
- Part Number:
- 160TXW82MEFR8X35
- Výrobce:
- Rubycon
- Popis:
- CAP ALUM
- dostupné množství:
- 19074 Pieces
- Datový list:
- 1.160TXW82MEFR8X35.pdf2.160TXW82MEFR8X35.pdf
Úvod
BYCHIPS je distribuční odrůda pro 160TXW82MEFR8X35, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 160TXW82MEFR8X35 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Výrobní standardní doba výroby: | 16 Weeks |
| Výrobní číslo výrobce: | 160TXW82MEFR8X35 |
| Rozšířený popis: | Aluminum Capacitors |
| Popis: | CAP ALUM |
| Email: | [email protected] |
Související díly pro 160TXW82MEFR8X35
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
160TXW68MEFC8X30 | Rubycon | CAP ALUM 68UF 20% 160V RADIAL | Dotaz |
 |
160TXW390MEFC18X30 | Rubycon | CAP ALUM 390UF 20% 160V RADIAL | Dotaz |
 |
160TXW82MEFC10X25 | Rubycon | CAP ALUM 82UF 20% 160V RADIAL | Dotaz |
 |
160TXW82MEFR10X25 | Rubycon | CAP ALUM | Dotaz |
 |
160TXW470MEFC18X35 | Rubycon | CAP ALUM 470UF 20% 160V RADIAL | Dotaz |
 |
160TXW150MEFC10X40 | Rubycon | CAP ALUM 150UF 20% 160V RADIAL | Dotaz |
 |
160TXW180MEFC10X50 | Rubycon | CAP ALUM 180UF 20% 160V RADIAL | Dotaz |
 |
160TXW820MEFC18X50 | Rubycon | CAP ALUM 820UF 20% 160V RADIAL | Dotaz |
 |
160TXW270MEFC12.5X40 | Rubycon | CAP ALUM 270UF 20% 160V RADIAL | Dotaz |
 |
160TXW330MEFC16X30 | Rubycon | CAP ALUM 330UF 20% 160V RADIAL | Dotaz |
 |
160TXW330MEFC12.5X50 | Rubycon | CAP ALUM 330UF 20% 160V RADIAL | Dotaz |
|
160TXW220MEFR10X60 | Rubycon | CAP ALUM | Dotaz |
 |
160TXW390MEFC16X35 | Rubycon | CAP ALUM 390UF 20% 160V RADIAL | Dotaz |
|
160TXW220MEFC16X25 | Rubycon | CAP ALUM | Dotaz |
 |
160TXW560MEFC16X50 | Rubycon | CAP ALUM 560UF 20% 160V RADIAL | Dotaz |
 |
160TXW330MEFC18X25 | Rubycon | CAP ALUM 330UF 20% 160V RADIAL | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers