Koupit 160PX47MEFC10X20 s BYCHPS
Koupit se zárukou
160PX47MEFC10X20
- Part Number:
- 160PX47MEFC10X20
- Výrobce:
- Rubycon
- Popis:
- CAP ALUM RAD
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16299 Pieces
- Datový list:
- 1.160PX47MEFC10X20.pdf2.160PX47MEFC10X20.pdf
Úvod
BYCHIPS je distribuční odrůda pro 160PX47MEFC10X20, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 160PX47MEFC10X20 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 16 Weeks |
| Výrobní číslo výrobce: | 160PX47MEFC10X20 |
| Rozšířený popis: | Aluminum Capacitors |
| Popis: | CAP ALUM RAD |
| Email: | [email protected] |
Související díly pro 160PX47MEFC10X20
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
160PX330MEFC18X31.5 | Rubycon | CAP ALUM 330UF 20% 160V RADIAL | Dotaz |
 |
160PX47MEFCT810X20 | Rubycon | CAP ALUM 47UF 20% 160V RADIAL | Dotaz |
 |
160PX100MEFC12.5X25 | Rubycon | CAP ALUM RAD | Dotaz |
 |
EEU-FR1E102L | Panasonic Electronic Components | CAP ALUM 1000UF 20% 25V RADIAL | Dotaz |
 |
160PX470MEFC18X40 | Rubycon | CAP ALUM 470UF 20% 160V RADIAL | Dotaz |
 |
160PX22MEFC10X12.5 | Rubycon | CAP ALUM 22UF 20% 160V RADIAL | Dotaz |
|
160PX470MEFCGC18X40 | Rubycon | CAP ALUM 470UF 20% 160V RADIAL | Dotaz |
|
450VXS180MEFC22X45 | Rubycon | CAP ALUM 180UF 20% 450V SNAP | Dotaz |
|
160PX22MEFCT810X12.5 | Rubycon | CAP ALUM 22UF 20% 160V RADIAL | Dotaz |
 |
MAL210217562E3 | Vishay BC Components | CAP ALUM 5600UF 20% 450V SCREW | Dotaz |
|
160PX220MEFC16X31.5 | Rubycon | CAP ALUM RAD | Dotaz |
 |
LAQ2P331MELB25 | Nichicon | CAP ALUM 330UF 20% 220V SNAP | Dotaz |
|
160PX33MEFC10X16 | Rubycon | CAP ALUM 33UF 20% 160V RADIAL | Dotaz |
 |
160PX10MEFC8X11.5 | Rubycon | CAP ALUM 10UF 20% 160V RADIAL | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers