Koupit 1393760-1 s BYCHPS
Koupit se zárukou
1393760-1
- Part Number:
- 1393760-1
- Popis:
- RELAY SOCKET HOLD DOWN SPRING
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15577 Pieces
- Datový list:
- 1393760-1.pdf
Úvod
BYCHIPS je distribuční odrůda pro 1393760-1, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 1393760-1 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Specifikace: | For Cradle W Size II |
|---|---|
| Série: | AXICOM |
| Ostatní jména: | V23154Z1024 |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 17 Weeks |
| Výrobní číslo výrobce: | 1393760-1 |
| Pro použití s / příbuzné výrobky: | Cradle Sockets, AXICOM |
| Rozšířený popis: | Clip, Hold Down Cradle Sockets, AXICOM |
| Popis: | RELAY SOCKET HOLD DOWN SPRING |
| Barva: | - |
| Typ příslušenství: | Clip, Hold Down |
| Email: | [email protected] |
Související díly pro 1393760-1
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
1393761-1 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | Dotaz |
|
1393759-1 | TE Connectivity Potter & Brumfield Relays | RELAY | Dotaz |
|
1393761-8 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | Dotaz |
|
1393762-3 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | Dotaz |
|
1393762-6 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | Dotaz |
|
1393761-9 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | Dotaz |
|
1393762-7 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | Dotaz |
|
1393760-2 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET HOLD DOWN SPRING | Dotaz |
|
1393762-5 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | Dotaz |
|
1393761-6 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | Dotaz |
|
1393759-2 | TE Connectivity Potter & Brumfield Relays | RELAY | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers