Koupit 10M04DCU324I7P s BYCHPS
Koupit se zárukou
10M04DCU324I7P
- Part Number:
- 10M04DCU324I7P
- Výrobce:
- Altera (Intel)
- Popis:
- IC FPGA 246 I/O 324UBGA
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15114 Pieces
Úvod
BYCHIPS je distribuční odrůda pro 10M04DCU324I7P, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 10M04DCU324I7P e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 1.15 V ~ 1.25 V |
|---|---|
| Celkem RAM Bits: | 193536 |
| Dodavatel zařízení Package: | 324-UBGA (15x15) |
| Série: | MAX® 10 |
| Paket / krabice: | 324-LFBGA |
| Provozní teplota: | -40°C ~ 100°C (TJ) |
| Počet logických prvků / buněk: | 4000 |
| Počet laboratoří / CLBs: | 250 |
| Počet I / O: | 246 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní číslo výrobce: | 10M04DCU324I7P |
| Popis: | IC FPGA 246 I/O 324UBGA |
| Email: | [email protected] |
Související díly pro 10M04DCU324I7P
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
10M04DCU324I7G | Altera | IC FPGA 246 I/O 324UBGA | Dotaz |
|
10M04DAU324I7G | Altera | IC FPGA 246 I/O 324UBGA | Dotaz |
|
10M04DCU324C8G | Altera | IC FPGA 246 I/O 324UBGA | Dotaz |
|
10M04DAU324C8G | Altera | IC FPGA 246 I/O 324UBGA | Dotaz |
 |
10M04SCE144C8G | Altera | IC FPGA 101 I/O 144EQFP | Dotaz |
 |
10M04SCU169I7G | Altera | IC FPGA 130 I/O 169UBGA | Dotaz |
 |
10M04DCF256C7G | Altera | IC FPGA 178 I/O 256FBGA | Dotaz |
|
10M04DCF256C8G | Altera | IC FPGA 178 I/O 256FBGA | Dotaz |
|
10M04DCU324A7G | Altera | IC FPGA 246 I/O 324UBGA | Dotaz |
|
10M04SAE144C8G | Altera | IC FPGA 101 I/O 144EQFP | Dotaz |
|
10M04SFE144I7G | Altera | IC FPGA/CPLD NV 144EQFP | Dotaz |
|
10M04SAE144I7G | Altera | IC FPGA 101 I/O 144EQFP | Dotaz |
 |
10M04SAM153C8G | Altera | IC FPGA 112 I/O 153MBGA | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers