Koupit 100LSW15000MEFC51X118 s BYCHPS
Koupit se zárukou
100LSW15000MEFC51X118
- Part Number:
- 100LSW15000MEFC51X118
- Výrobce:
- Rubycon
- Popis:
- SCREW TERMINAL
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13683 Pieces
Úvod
BYCHIPS je distribuční odrůda pro 100LSW15000MEFC51X118, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 100LSW15000MEFC51X118 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 16 Weeks |
| Výrobní číslo výrobce: | 100LSW15000MEFC51X118 |
| Rozšířený popis: | Aluminum Capacitors |
| Popis: | SCREW TERMINAL |
| Email: | [email protected] |
Související díly pro 100LSW15000MEFC51X118
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
B43305A2188M67 | EPCOS (TDK) | CAP ALUM 1800UF 20% 200V SNAP | Dotaz |
 |
100LSW2700MEFC36X63 | Rubycon | CAP ALUM 2700UF 20% 100V SCREW | Dotaz |
 |
100LSW22000MEFC64X119 | Rubycon | CAP ALUM 22000UF 20% 100V SCREW | Dotaz |
 |
100LSW47000M77X141 | Rubycon | SCREW TERMINAL | Dotaz |
 |
100LSW15000MNB51X118 | Rubycon | CAP ALUM 15000UF 20% 100V SCREW | Dotaz |
 |
16YXG470MEFCTA8X11.5 | Rubycon | CAP ALUM 470UF 20% 16V RADIAL | Dotaz |
|
100LSW39000M77X141 | Rubycon | SCREW TERMINAL | Dotaz |
|
100LSW2200M36X50 | Rubycon | SCREW TERMINAL | Dotaz |
|
100LSW8200M51X83 | Rubycon | SCREW TERMINAL | Dotaz |
|
100LSW2200MEFC36X50 | Rubycon | CAP ALUM 2200UF 20% 100V SCREW | Dotaz |
 |
EKXJ351ELL151ML40S | United Chemi-Con | CAP ALUM 150UF 20% 350V RADIAL | Dotaz |
 |
200PK47MEFCT810X20 | Rubycon | CAP ALUM 47UF 20% 200V RADIAL | Dotaz |
 |
100LSW10000MNB51X98 | Rubycon | CAP ALUM 10000UF 20% 100V SCREW | Dotaz |
|
100LSW4700M36X83 | Rubycon | SCREW TERMINAL | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers