Koupit 0CBF035.S s BYCHPS
Koupit se zárukou
0CBF035.S
- Part Number:
- 0CBF035.S
- Výrobce:
- Littelfuse
- Popis:
- CBK FUSE CLIP CIRCUIT BRKR 35A
- Stav volného vedení / RoHS:
- Obsahuje olověný / RoHS neodpovídající
- dostupné množství:
- 13132 Pieces
- Datový list:
- 0CBF035.S.pdf
Úvod
BYCHIPS je distribuční odrůda pro 0CBF035.S, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 0CBF035.S e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | CBF |
|---|---|
| Ostatní jména: | 0CBF035S CBF035.S CBF035S |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 11 Weeks |
| Výrobní číslo výrobce: | 0CBF035.S |
| Popis: | CBK FUSE CLIP CIRCUIT BRKR 35A |
| Email: | [email protected] |
Související díly pro 0CBF035.S
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
0CBF035.XP | Littelfuse Inc. | CBK FUSE CLIP CIRCUIT BRKR 35A | Dotaz |
|
0CBF030.S | Littelfuse Inc. | CBK FUSE CLIP CIRCUIT BRKR 30A | Dotaz |
|
0CBF035.Z | Littelfuse Inc. | FUSE CLIP CIRCUIT BRKR BOX 35A | Dotaz |
|
0CBF010.S | Littelfuse Inc. | CBK FUSE CLIP CIRCUIT BRKR 10A | Dotaz |
|
0CBF030.XP | Littelfuse Inc. | 2BK FUSE CLIP CIRCUIT BRKR 30A | Dotaz |
|
0CBF035.XPA | Littelfuse Inc. | CBK FUSE CLIP CIRCUIT BRKR 35A | Dotaz |
|
0CBF010.XP | Littelfuse Inc. | CBK FUSE CLIP CIRCUIT BRKR 10A | Dotaz |
|
0CBF040.Z | Littelfuse Inc. | FUSE CLIP CIRCUIT BRKR BOX 40A | Dotaz |
|
0CBF025.S | Littelfuse Inc. | CBK FUSE CLIP CIRCUIT BRKR 25A | Dotaz |
|
0CBF015.S | Littelfuse Inc. | CBK FUSE CLIP CIRCUIT BRKR 15A | Dotaz |
|
0CBF025.XP | Littelfuse Inc. | CBK FUSE CLIP CIRCUIT BRKR 25A | Dotaz |
|
0CBF030.Z | Littelfuse Inc. | FUSE CLIP CIRCUIT BRKR BOX 30A | Dotaz |
|
0CBF025.Z | Littelfuse Inc. | FUSE CLIP CIRCUIT BRKR BOX 25A | Dotaz |
|
0CBF020.S | Littelfuse Inc. | CBK FUSE CLIP CIRCUIT BRKR 20A | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers